Slice, preparing method thereof, circuit substrate with slice, and preparing method of circuit substrate

Abstract

The invention discloses a slice for forming a cutting substrate protecting film. The slice comprises a first release sheet and a protecting film forming layer. The protecting film forming layer is formed on a release surface of the first release sheet, wherein the protecting film forming layer comprises the components of silicon dioxide which is modified by an amino silane coupling agent or an epoxy siloxane coupling agent, and epoxy resin. The invention further discloses a preparing method of the slice, and a circuit cutting substrate with the protecting film on a random surface.

Description

Technical field [0001] The present invention relates to a sheet for forming a protective film for cutting a substrate, which can effectively form a protective film on any surface of a circuit cutting substrate for semiconductors, thereby promoting the improvement of the production efficiency of the cutting substrate. Background technique [0002] Integrated circuits have been widely used in semiconductor technology; integrated circuit wafers such as semiconductor wafers in circuit substrates are prepared, which are separated by tabular dividing lines (so-called streets). Each area separated by a border defines a semiconductor chip. That is, the wafer is cut along the boundary to obtain multiple semiconductor chips. [0003] The cutting of the circuit-cut substrate along the boundary is usually performed by a cutting device (so-called cutter). This cutting device includes a chuck table for fixing the circuit substrate (which is a working object), a cutting member for cutting the c...

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned circuit cutting substrate is usually a material with high brittleness, and it is easy to cause tiny scratches on the back due to mechanical grinding

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