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Substrate wet process process method and substrate wet process process device

A process method and technology of wet process, applied in the field of substrate wet process process method and wet process process device, can solve the problems such as the reduction of etching yield, achieve resource saving, improve etching process and cleaning process method, control etching rate and The effect of the amount of liquid medicine

Active Publication Date: 2020-07-28
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the embodiment of the present invention provides a substrate wet process process method and a wet process process device, which are used to solve the technical problem of reduced etching yield in the existing wet etching process

Method used

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  • Substrate wet process process method and substrate wet process process device
  • Substrate wet process process method and substrate wet process process device
  • Substrate wet process process method and substrate wet process process device

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Embodiment Construction

[0044] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0045] The step numbers in the drawings are only used as reference signs for the steps and do not indicate the order of execution.

[0046] The substrate wet process process method in the embodiment of the present invention includes cleaning before etching, cleaning after etching, and cleaning after etching.

[0047] Cleaning before etching includes one or more of the following methods:

[0048] Ultraviolet radiation is used to remove organic matter ...

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Abstract

The invention discloses a substrate wet process technological method, and aims to solve the technical problem of potential damage in the substrate processing process in the existing wet etching process. The technological method comprises the steps of setting a bearing platform and fixing a substrate through the bearing platform; moving the bearing platform along a circumferential track to convey the substrate; setting processing equipment along the outer side of the circumferential track; and in the substrate conveying process, adjusting the orientation and / or height of the substrate by the bearing platform to be matched with the processing equipment. The moving technological beat of the bearing platform along the circumferential track is controlled by an annular conveyor belt, so that consumed resource, manpower, time and other maintenance cost in replacing a huge number of rolling wheels periodically can be saved; the etching process and cleaning technological method are further improved; the jetting direction of the medicinal liquid and net water flow is changed; etching rate and medicinal liquid take-out amount are controlled effectively; and the cost is lowered while the etching quality can be effectively ensured. The invention also provides a substrate wet process technological apparatus.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a substrate wet process process method and a wet process process device. Background technique [0002] The devices used in the existing substrate wet process method usually use sequentially arranged rollers (ie, rollers) on the conveyor belt to carry the glass substrate to complete the transportation of the substrate between processes. It takes time and effort to maintain a large number of rollers, and any single point of failure will cause damage to the substrate, forming scratches or fragments, resulting in a decrease in the etching yield. However, the conveyor belt as an infrastructure is expensive, and large-scale periodic replacement of rollers consumes a lot of maintenance costs. Contents of the invention [0003] In view of this, the embodiments of the present invention provide a substrate wet process process method and a wet process process device, which are used to s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02H01L21/67H01L21/677
CPCH01L21/02057H01L21/67011H01L21/67023H01L21/67034H01L21/67051H01L21/677H01L2221/67H01L2221/683
Inventor 孙静
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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