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A kind of high-performance low-temperature soldering lead-free solder paste and preparation method thereof

A lead-free solder paste and soldering technology, applied in the direction of welding equipment, manufacturing tools, welding media, etc., can solve the problems of many residues, blackening of the periphery after welding, and a large number of tin beads, etc., and achieve high softening point, Improved welding performance and high viscosity

Active Publication Date: 2019-05-14
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The present invention aims to propose a high-performance low-temperature soldering lead-free solder paste and its preparation method. The solder paste can well solve the common problems of current low-temperature lead-free solder paste such as blackening of the periphery after soldering, many residues, and the number of tin beads. There are many problems, and at the same time it has the characteristics of good storage stability, long-term printing without drying, etc.

Method used

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  • A kind of high-performance low-temperature soldering lead-free solder paste and preparation method thereof
  • A kind of high-performance low-temperature soldering lead-free solder paste and preparation method thereof
  • A kind of high-performance low-temperature soldering lead-free solder paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] A preparation method of high-performance low-temperature soldering lead-free solder paste, the solder paste is composed of:

[0052]

[0053]

[0054] Preparation method: Weigh 10g of dipentene resin, 10g of butene resin, 39g of rosin resin, 31g of propylene glycol methyl ether, 19g of N,N-dimethylethanolamine, and 10g of styrene-butadiene copolymer into the reaction kettle, Fully stir and mix at 125°C, and obtain a flux matrix after complete melting; at 70°C, mix 1.5g n-pentanoic acid, 0.2g n-octanoic acid, 0.3g isononanoic acid, 4g benzoic acid, 4.9g maleic anhydride, 2g mineral oil, 8g polyoxypropyl polyoxyethylglycerol ether, 2.6g polyethylene glycol 600, 7.4g trimethylolpropane, 0.1g boric acid, 4g erucamide, 6g octadecyl stearic acid The amines are added sequentially by emulsification and dispersion, and the flux obtained after cooling is mixed with 840g of Sn58Bi solder alloy powder in proportion to obtain 1 kg of a high-performance low-temperature lead-fre...

Embodiment 2

[0056] A method for preparing high-performance low-temperature lead-free solder paste, the composition of which is calculated by weight percentage:

[0057]

[0058] Preparation method: Weigh 20g of terpene resin, 26g of rosin resin, 19g of dipropylene glycol dimethyl ether, 4g of dipropylene glycol butyl ether, and 2g of dipropylene glycol butyl ether acetate into the reaction kettle, fully stir and mix at 105°C, and completely melt Finally, the flux matrix is ​​obtained; at 85°C, 1.5g n-heptanoic acid, 1.0g n-nonanoic acid, 22.5g o-hydroxybenzoic acid, 1.1g polyoxypropyl glyceryl ether, 0.9g polyoxypropyl polyoxyethylene Glyceryl ether, 0.6g succinic acid amide, 1.2g salicylic acid amide, 0.1g hydroxyethylene diphosphonic acid, 0.1g triethanolamine borate, 3g organic acid modified bentonite, 2g ITOHWAX K530 rheological aid The flux is added sequentially by emulsification and dispersion, and the flux obtained after cooling is mixed with 895g of Sn58Bi0.1Ag solder alloy pow...

Embodiment 3

[0060] A method for preparing high-performance low-temperature lead-free solder paste, the composition of which is calculated by weight percentage:

[0061]

[0062] Preparation method: Weigh 20g of butene resin, 7g of rosin resin, 13g of propylene glycol methyl ether acetate, 25g of dipropylene glycol methyl ether acetate, and 10g of N-methylpyrrolidone into the reaction kettle, fully stir and mix at 85°C, and completely melt Obtain a flux matrix; at 45°C, add 0.67g isocaproic acid, 1.2g sulfosalicylic acid, 0.13g 2,4-hexadienoic acid, 0.8g simethicone, 0.2g polyoxyethylene glyceryl ether, 0.1g Polyethylene glycol 400, 0.9g 2‐methylbenzimidazole, 0.3g triethanolamine borate, 0.7g trimethylolpropane borate, 7g ethylene bisstearamide, 8g CRAYCALLAC CVP rheological aid The flux is added in turn by emulsification and dispersion, and the flux obtained after cooling is mixed with 905g of Sn58Bi0.3Ag alloy powder in proportion to obtain a high-performance low-temperature lead-fre...

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Abstract

The invention discloses a high-performance low-temperature soldering lead-free solder paste and a preparation method thereof. The soldering lead-free solder paste comprises, by weight, 0.2-2.5% of a combined surfactant, 0.1-1.0% of an antifoaming agent, 0.01-0.1% of an active strengthening agent, 0.1-1.0% of a normal-temperature activity inhibitor, 0.5-1.5% of a thixotropic agent, 2.5-6.0% of a cosolvent, 2.7-5.9% of a resin film-forming agent, and the balance Sn-based solder alloyed powder; and the combined surfactant is formed by mixing liquid saturated monocarboxylic acid and solid unsaturated low-boiling-point acid according to the weight ratio of 1:2-1:9. The high-performance low-temperature soldering lead-free solder paste and the preparation method thereof can solve the common problems of a large quantity of black residues and solder balls and the like of current low-temperature soldering lead-free solder pastes after welding, meanwhile, the paste has the characteristics of being good in storage stability and not dried in the long-time printing process, and the high-performance low-temperature soldering lead-free solder paste is particularly suitable for the field of assembly of low temperature electronic surfaces.

Description

technical field [0001] The invention relates to soldering, in particular to low-temperature electronic packaging soldering, in particular to a lead-free solder paste of a tin-bismuth alloy system and a preparation method thereof. Background technique [0002] Solder paste is a paste made by uniformly mixing solder alloy powder and flux. It is an important connecting material that emerged with surface mount technology. Compared with products in the form of solder bars and solder wires prepared by traditional processes, solder paste has outstanding features such as being easy to be accurately distributed and suitable for industrial automated production. [0003] With the rapid development of the electronics industry, the demand for heat-sensitive low-temperature soldering applications such as intelligent hardware radiators, LED lighting component placement, and solar photovoltaics has grown rapidly. However, the mainstream tin-silver-copper-based lead-free solder paste in the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/36B23K35/40
CPCB23K35/262B23K35/36B23K35/40
Inventor 张新平马发谦周敏波马骁谭梦颖周舟
Owner SOUTH CHINA UNIV OF TECH
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