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Manufacturing method of ultrathin package substrate and related product

A technique for encapsulating substrates and manufacturing methods, which is applied in the fields of technology for producing decorative surface effects, decorative arts, and measuring devices, and can solve problems such as low machinability, easy damage or damage, and insufficient strength of ultra-thin packaging substrates, etc. Achieve the effect of no need for equipment investment and transformation, avoid plate deformation, and no need for new material development certification

Active Publication Date: 2017-08-25
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Embodiments of the present invention provide a method for manufacturing an ultra-thin packaging substrate and related products, so as to help solve the technical problems that the ultra-thin packaging substrate has low processability due to insufficient strength and is easily damaged or damaged during processing.

Method used

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  • Manufacturing method of ultrathin package substrate and related product
  • Manufacturing method of ultrathin package substrate and related product
  • Manufacturing method of ultrathin package substrate and related product

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Embodiment Construction

[0032] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0033] The terms "first", "second", "third" and the like in the description and claims of the present invention and the above drawings are used to distinguish different objects, rather than to describe a specific order. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-exclus...

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Abstract

The invention discloses a manufacturing method of an ultrathin package substrate and a related product. The manufacturing method can help solve a technical problem that the ultrathin package substrate is low in machinability, each to be injured or damaged in the machining process due to insufficient strength. The method comprises the following steps: providing an ultrathin copper-clad plate; forming a rigid reinforcing layer on a non-working region of the ultrathin copper-clad plate; performing conventional line machining on the working region of the ultrathin copper-clad plate; and performing shape machining on the ultrathin copper-clad plate to remove the non-working region, thereby manufacturing the ultrathin package substrate.

Description

technical field [0001] The invention relates to the technical field of packaging substrate processing, in particular to a method for manufacturing an ultra-thin packaging substrate and related products. Background technique [0002] At present, IC packaging is developing towards thinner and smaller, and the packaging substrate is also developing towards thinner. For example, in the field of integrated circuit packaging such as micro-electromechanical system sensor product modules, it needs to be applied to ultra-thin packaging substrates or thin packaging substrates. When the thickness of the finished plate reaches 100 μm or less, the strength of the product manufactured by the traditional process is insufficient, resulting in difficult processing and low yield. [0003] In the traditional manufacturing process, the ultra-thin packaging substrate is mainly processed through the coreless substrate process. The processing process generally includes: [0004] S1, making the ca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00B81B7/00
CPCB81B7/0045B81B2201/02B81C1/00666
Inventor 张云川郑仰存谷新
Owner SHENNAN CIRCUITS
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