Air volume adjusting plate for plug-in box, and application method thereof

Abstract

The invention discloses an air volume adjusting plate for a plug-in box. The air volume adjusting plate comprises a plate body matching the shape of the bottom of the plug-in box; a connection portion disposed on a side surface of the plate body; a connection port disposed on the connection portion and to be connected with the plug-in box; a plurality of vent holes arranged on the plate body regularly; and latches inserted into different vent holes and used for changing the air volume at different positions on the plate body. All the vent holes are arranged in parallel on the plate body in a plurality of rows. Each gap between guide rails in the plug-in box corresponds to at least one row of vent holes. The invention also discloses the application method of the air volume adjusting plate. The air volume adjusting plate ingeniously changes the air volume of different functional modules by the arrangement of the latches on the plate body. Thus, each module is ventilated and cooled on demand, the air volume of respective modules are reasonably distributed, the heat dissipation efficiency of a draught fan is improved, the cost of plug-in box is reduced integrally, and a good balance is made between the air volume and draught fan noise and power consumption. The air volume adjusting plate is ingenious in design, simple in structure, and easy to use.

Description

technical field [0001] The invention relates to a box insertion component, in particular to an air volume regulating plate for a box insertion and an application method thereof. Background technique [0002] A subrack, also known as a U box, is a standard chassis that is widely used in structural cabinets such as communication cabinets, power cabinets, and CPCI (Compact Peripheral Component Interconnect, Compact PCI). There are multiple guide rails arranged side by side in the lower part of the box for plugging and installing various functional modules. This standardized module installation and plugging method is favored by users because of its convenience. And because the modules in the subrack are installed side by side, there will be no problem of obstructed air circulation caused by various boards blocking each other in the ordinary chassis. In contrast, the heat dissipation performance of the subrack is relatively excellent. [0003] With the development of science and...

AI Technical Summary

Problems solved by technology

The use of the existing heat dissipation structure and the heat dissipation method of evenly distributing the ventilation volume will lead to insufficient ventilation of some modules with high heat generation. After a long time of operation, the temperature of the module exceeds the allowable temperature, and it is easy to reduce the performance of the module or even damage it.

[0006] For this situation, the conventional solution adopted in this field is mainly to increase the total ventilation volume generated by the fans so that the average ventilation volume allocated to each module can meet the heat dissipation demand of the module with the largest heat generation, that is, according to The calorific value of the module with the largest calorific value is multiplied by the number of modules as the total calorific value to calculate the total ventilation required, which will lead to a large redundancy in the ventilation. Produce more noise, the corresponding use cost and equipment cost will increase

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