A ceramic sheet packaging method and packaging line
A packaging line and ceramic thin plate technology, which is applied in the field of ceramic tile packaging, can solve the problems of lower product quality, fragility, and scratches on the product surface.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0046] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.
[0047] like figure 1 Shown, a kind of ceramic sheet packing method, comprises the steps:
[0048] Step 1) Stacking the ceramic thin plates: placing the ceramic thin plates in the lifting stacking device 100, stacking no less than three types of ceramic thin plates, so that multiple ceramic thin plates are stacked;
[0049] Step 2) Wrapping the ceramic thin plates: transport the laminated ceramic thin plates to the packaging device 200, the packaging device 200 will lift the laminated ceramic thin plates, place packaging cardboard on the bottom of both sides of the ceramic thin plates, and fold the packaging cardboard to stack Wrapped on both sides of the ceramic sheet;
[0050] Step 3) Bundle the packaging cardboard: the packaged ceramic sheet package is transported to the packaging device 300, an...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com