Apparatus and method for fiber optic bundle coupling

Abstract

The invention discloses a device and a method for coupling optical fiber bundles, wherein optical coupling efficiency can be improved. The device comprises at least one optical fiber bundle, at least one waveguide bundle, at least one speckle shaping unit set and at least one target grating set. Each optical fiber bundle comprises at least one fiber core. Each waveguide bundle comprises at least one optical waveguide. Each speckle shaping unit set comprises at least one speckle shaping unit. Each target optical grating set comprises at least one target grating, wherein the first optical waveguide is used for receiving first signal light which is input from the first fiber core. The first speckle shaping unit is used for receiving the first signal light which is output through the first optical waveguide and performing speckle shaping processing on the speckle that corresponds with the first signal light so that the first signal light is transmitted to the first target grating. After speckle shaping processing is performed on the first signal light, a first speckle which is reflected to the first target grating is smaller than a second speckle that is reflected to the first target grating without speckle shaping processing.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of optical communication, and more specifically, relate to a device and method for optical fiber bundle coupling. Background technique [0002] With the development of high-speed, high-capacity optical communication technology, a key technology in optical integrated devices is to realize the effective coupling of optical waveguides and optical fibers. For example, the optical waveguide may be a silicon-based Photonic Integrated Circuit ("PIC" for short) chip. [0003] The grating coupler is a key device for the input and output of the silicon-based PIC chip. The signal light needs to be coupled from the fiber bundle to the silicon-based PIC chip in the grating coupler through the waveguide bundle. However, the signal light is reflected to the silicon-based PIC chip by mirror reflection. When in the PIC chip, due to the divergence of light, the mode spot size reflected into the silicon-...

AI Technical Summary

Problems solved by technology

[0003] The grating coupler is the key device for the input and output of the silicon-based PIC chip. The signal light needs to be coupled from the fiber bundle to the silicon-based PIC chip in the grating coupler through the waveguide bundle. However, the signal light is reflected to the silicon-based PIC chip by mirror reflection. When in a PIC chip, due to the divergence of light, the mode spot size reflected into the silicon-based PIC chip is mismatched with the size of the mode spot in the silicon-based PIC chip. This mismatch of mode spots will lead to a huge loss of coupling efficiency

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