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A control system for the transducer of a low-power wire bonding machine

A control system and transducer technology, applied in the direction of output power conversion devices, electrical components, etc., can solve problems such as shortening equipment delivery time, abnormal phase lock, etc., to save equipment costs, shorten delivery time, and improve welding wire quality Effect

Active Publication Date: 2019-07-30
深圳市大族封测科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the technical problems existing in the prior art, to provide a control system for the transducer of a low-power wire bonding machine, to realize the transducer with low power through a control board, and to solve the problem of low-power transducer The problem of abnormal phase lock is prone to occur when the energy generator is working with a small signal, and there is no need to redesign the control board, which reduces the cost of the equipment and shortens the delivery time of the equipment

Method used

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  • A control system for the transducer of a low-power wire bonding machine
  • A control system for the transducer of a low-power wire bonding machine

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Embodiment Construction

[0025] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

[0027] refer to figure 1 As shown, the control system of a low-power wire bonding m...

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Abstract

The invention discloses a high-precision control system for a small-power wire bonding machine transducer. An FPGA of a power output pre-stage circuit outputs a control signal to a DDS and a DAC, and an analog switch according to instruction information of a host; the DDS and the DAC synthesize the control signal into a frequency signal and an amplitude signal respectively; the analog switch realizes power gear adjustment by selecting corresponding amplification coefficient; an amplification and filtering module performs amplification and filtering and then outputs the processed signals to a superimposer to be superimposed to obtain an ultrasonic frequency small signal; a second-order band-pass filtering module performs second-order filtering to filter out high-frequency and low-frequency interference signals out of the band pass; a high-precision combination power amplification module performs amplification to obtain an ultrasonic frequency signal which satisfies power requirement of the transducer; and a transformer performs matching on the ultrasonic frequency signal and efficiently applies the signal to the transducer so as to excite vibration of the transducer, and the transducer outputs a generated voltage / current signal to a power output post-stage circuit. The high-precision control system is applicable to the small-power wire bonding machine transducer.

Description

technical field [0001] The invention relates to the technical field of industrial control, and more specifically relates to a control system for a transducer of a low-power wire bonding machine. Background technique [0002] The ultrasonic control accuracy of the wire bonding machine transducer is the key to improving the overall performance of the wire bonding machine, which directly affects the wire bonding quality and speed of the wire bonding machine. In the design and production process of wire bonding machine equipment, different power transducers will be selected according to actual needs and cost considerations, (the impedance of different power transducers is different, for example: the impedance of 5W transducers in the United States is generally at About 20Ω; and the impedance of 2.5W small transducers varies greatly among different companies, usually greater than 20Ω). When the original equipment uses a 5W transducer and replaces it with a 2.5W transducer, there...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02M1/12
CPCH02M1/12
Inventor 周云渠崔存华罗诚高云峰
Owner 深圳市大族封测科技股份有限公司
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