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Magnetic field providing device, magnetron sputtering device, and magnetron sputtering method

A magnetron sputtering and magnetic field technology, applied in sputtering coating, metal material coating process, vacuum evaporation coating and other directions, can solve the problem that the magnetic field is not a uniform magnetic field, and achieve the effect of uniform magnetic field strength

Inactive Publication Date: 2019-03-12
BOE TECH GRP CO LTD
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  • Claims
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Problems solved by technology

[0005] The purpose of the technical solution of the present invention is to provide a magnetic field providing device, magnetron sputtering equipment and a method of magnetron sputtering, to solve the problem that the magnetic field formed by the magnet in the magnetron sputtering process in the prior art is not a uniform magnetic field

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  • Magnetic field providing device, magnetron sputtering device, and magnetron sputtering method

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Embodiment Construction

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0041] An embodiment of the present invention provides a magnetic field providing device, such as figure 1 As shown, the magnetic field providing device includes:

[0042] A plurality of magnetic field detection elements 10 are arranged in an array in a detection plane, and are used to detect the magnetic field strength at different positions in the detection plane;

[0043] A plurality of magnet units 20 are respectively arranged opposite to the dete...

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Abstract

The invention provides a magnetic field providing device, magnetron sputtering equipment and a method using the magnetron sputtering equipment. The magnetic field providing device comprises a plurality of magnetic field detecting elements, a plurality of magnet units and a plurality of adjusting structures. The multiple magnetic field detecting elements are distributed in an array mode in a detecting plane and used for detecting the magnetic field intensities of different positions in the detecting plane. The multiple magnet units are arranged opposite to the detecting plane, and the multiple magnetic field detecting elements are located in magnetic fields of the magnet units. Each magnet unit is connected with one corresponding adjusting structure. By the adoption of the adjusting structures, the magnet units can adjust the magnetic field detecting elements to detect the obtained magnetic field intensities relative to distance change of the detecting plane, and the magnetic field intensities on the detecting plane are uniform. According to the magnetic field providing device, the magnetic field detecting elements are used for detecting the magnetic field intensities on the detecting plane away from the magnet units by a preset distance, the adjusting structures connected with the magnet units are used for adjusting the magnetic field intensities at the detecting plane position, and the uniform magnetic field intensities can be obtained on the detecting plane.

Description

technical field [0001] The invention relates to the technical field of display manufacturing technology, in particular to a magnetic field providing device, magnetron sputtering equipment and a magnetron sputtering method. Background technique [0002] Magnetron sputtering is a type of physical vapor deposition (Physical Vapor Deposition, PVD). The general sputtering method can be used to prepare various materials such as metals, semiconductors, and insulators. For example, the deposition of metal films in display manufacturing is exactly One of the embodiments is realized by using the magnetron sputtering process, which has the advantages of simple equipment, easy control, large coating area and strong adhesion. [0003] Magnetron sputtering includes many types depending on the process, but the general working principle is: use the interaction between the magnetic field and the electric field to make electrons run in a spiral shape near the surface of the target to increase...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/35C23C14/54
CPCC23C14/35C23C14/54
Inventor 杜建华王鑫
Owner BOE TECH GRP CO LTD
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