Vacuum lamination method and device for tsv process and bonding system using same

Abstract

The present invention relates to a laminating method for TSV process, comprising: an adhesive film supplying step of supplying the adhesive film with a transfer roller; an adhesive film cutting step of cutting the adhesive film into a prescribed shape with a cutter; the first The step of peeling the protective film, sticking the adhesive film cut into the prescribed shape to the lower part of the adhesive disc, and peeling the first protective film formed on the lower part of the adhesive film; the step of separating the adhesive disc, the first protective film After the peeled adhesive film is transferred to a vacuum laminator through the adhesive tray and placed on the carrier wafer, the adhesive tray is separated from the adhesive film; the vacuum lamination step, for placement on the carrier wafer laminating the adhesive film and the carrier wafer; and a second protective film peeling step of peeling the second protective film formed on the upper part of the adhesive film. Thereby, the adhesive film and the carrier wafer are laminated in a vacuum state to minimize generation of dust and particles, and high-quality lamination can be realized.

Description

technical field [0001] The invention is used to implement a lamination process for a through silicon via (TSV, through silicon via) process, and relates to a vacuum lamination method for a TSV process, a vacuum laminating apparatus (vacuum laminating apparatus) for a TSV process, and bonding using the same The system, the above method, apparatus and system can perform lamination of an adhesive film and a carrier wafer in a vacuum state, thereby minimizing generation of dust and particles, thereby enabling high-quality lamination. Background technique [0002] So far, researches on improving the integration degree of semiconductor devices have been continuously carried out. However, due to the physical limitations of exposure devices used to form circuit patterns, researchers in the field are faced with the difficult reality that they cannot further improve the integration level with existing equipment and methods. [0003] Recently, some new technologies that can improve th...

AI Technical Summary

Problems solved by technology

[0014] Also, in the past, peeling was performed on the upper side of the temporary adhesive film, so that particles fell on the peeled temporary adhesive film, resulting in a decrease in lamination quality

[0015] In addition, the overall process layout in the past is very complicated for supplying, cutting and peeling the temporary adhesive film, arranging it, and then laminating, bonding and debonding the carrier wafer, which also makes the device complicated. , large-scale, which makes it difficult to maintain, manage and repair, and the efficiency of the entire process is low, which leads to a decrease in throughput

Images