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Heat-dissipating device

A technology of heat sink and heat sink, used in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problems of low assembly efficiency and low heat dissipation efficiency, and improve assembly efficiency and heat dissipation efficiency. High, good heat dissipation effect

Inactive Publication Date: 2017-07-25
上海热像科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, heat sinks are mostly used for heat dissipation of equipment, and the heat sinks are directly fixed on the heating components to increase the heat dissipation area and avoid the failure of integrated circuits caused by excessive local temperatures. However, in the prior art The added heat sink is mainly for local heat dissipation. The heat sink is not in contact with the shell. It is still ineffective for the temperature of the entire device to diss

Method used

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] The purpose of the present invention is to provide a heat dissipation device with simple structure and large exchange area, which can not only solve the problem of local heat generation of components, but also dissipate heat from the whole machine. The role of the position solves the problem of poor heat dissipation effect of the existing heat dissipation device.

[0024] In order to make the above objects, features and advantages of the present inventi...

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Abstract

The invention discloses a heat dissipation device. The heat dissipation device is installed in an electrical equipment for dissipating heat from a circuit board inside the electrical equipment. The heat sink is provided with a copper column for installation; a guide rail device for installing the heat sink, the guide rail device is arranged on the casing of the electrical equipment, the heat sink is arranged on the guide rail device, and is connected to the guide rail device The guide rail device forms a heat conduction path, and also includes an auxiliary installation column, the auxiliary installation column is arranged on the installation copper column, and there is an installation gap for clamping the circuit board between the auxiliary installation column and the installation copper column . The heat dissipation device provided by the invention can not only solve the problem of local heat generation of components but also dissipate heat from the whole machine, has high heat dissipation efficiency and good heat dissipation effect, and also has the functions of fixing and position limiting to improve assembly efficiency.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a heat dissipation device for complete equipment. Background technique [0002] A large number of integrated circuits are used in the whole machine equipment. As we all know, high temperature is the enemy of integrated circuits. High temperature will not only lead to unstable operation of the system and shorten the service life, but may even cause some components to be burned, causing the integrated circuit system to fail to work normally. The heat that causes high temperature does not come from outside the computer, but from inside the computer, or the integrated circuit internal. The purpose of installing the heat sink is to absorb the heat and then dissipate it inside or outside the case, so as to ensure the normal temperature of the computer components and the normal operation of the integrated circuit. [0003] In the prior art, heat sinks are mostly used for hea...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/205
Inventor 张晓龙韦德
Owner 上海热像科技股份有限公司
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