Heat radiating cabinet and printed board assembly thereof

Abstract

The invention provides a heat radiating cabinet and a printed board assembly thereof, thereby realizing a purpose of reducing heat radiation cost on the condition that a plurality of electronic components exist on the printed board. The printed board assembly comprises a printed board and a heat radiator. The printed board is provided with a first electronic component and a second electronic component. The heating amount of the first electronic component is higher than that of the second electronic component. The first electronic component is connected with the heat radiator through a heat pipe in a heat conduction manner. The second electronic component is connected with the heat radiator through a heat conduction plate in the heat conduction manner. According to different heating amounts of the electronic components, different heat conducting mediums are selected. The heat pipe is utilized for the component with high heating amount for realizing heat conduction, thereby realizing quick and efficient heat conduction by means of a high heat conduction effect of the heat pipe; and the heat conduction plate is utilized for the component with low heating amount for performing heat conduction as the cost of the heat conduction plate is lower than that of the heat pipe.

Description

technical field [0001] The invention relates to a cooling case and a printed board assembly thereof. Background technique [0002] With the development of intelligent equipment and the application of prefabricated cabins, the future development of the chassis of power equipment will tend to be more and more miniaturized and integrated. Miniaturization and integration also cause heat concentration of components in the chassis. Therefore, The chassis needs to have a strong heat dissipation capability. Once a fault occurs, it will cause the components to overheat and stop working or even burn out, causing equipment failure or even a power outage. However, the heat dissipation method of power equipment is usually arranged on the chassis by arranging heat dissipation holes. For high-heat and high-power devices, fan cooling is supplemented. Fans need to be maintained and replaced regularly, which consumes manpower, especially in remote mountainous substations. Maintenance is even...

AI Technical Summary

Problems solved by technology

[0006] However, in the above-mentioned plug-in, when the number of electronic components is multiple and the calorific value of each electronic component is different, if all heat pipes are used for heat conduction, the cost is relatively high, and the fixing structure of the heat pipe is relatively complicated.

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