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Preparation method and production equipment for low profile flexible circuit board material

A technology of flexible circuit boards and production equipment, which is applied in the field of electronics, can solve problems such as inability to scale mass production and meet social production requirements, and achieve the effects of safe production, pollution-free and clean production, and industrialization

Inactive Publication Date: 2017-07-07
福建新嵛柔性材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this utility model is only suitable for scientific research or the production of coating samples, and cannot be mass-produced on a large scale, and cannot meet the requirements of social production

Method used

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  • Preparation method and production equipment for low profile flexible circuit board material
  • Preparation method and production equipment for low profile flexible circuit board material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A method for preparing a low-profile flexible circuit board material, comprising the following steps:

[0025] (1), pretreatment: be 25 microns with thickness, be 1000 millimeters in width, the flexible substrate PI film that length is 200 meters is placed in the pretreatment chamber 1, adopts roll-to-roll unfolding mode, successively passes through discharge roller 40, cooling Roller 41, receiving roller 42. The substrate is conveyed from the discharge roller 40 to the take-up roller 42, and the linear speed of the substrate during the production process is 10 m / min. It is dried by the infrared heater 10 and cleaned by the plasma device 11 . The heating temperature of the infrared heater 10 is 200° C., the plasma device 11 is a cathode ion source, the voltage is 750 volts, and the current is 0.4 ampere. The refrigeration temperature of the cryogenic trap 6 is -80°C.

[0026] (2) Vacuum magnetron sputtering method and vacuum evaporation method coating: the pretreated...

Embodiment 2

[0029] A method for preparing a low-profile flexible circuit board material, comprising the following steps:

[0030] (1), pretreatment: it is 50 microns with thickness, and width is 1050 millimeters, and the flexible substrate PET film that length is 500 meters is placed in pretreatment room 1, adopts roll-to-roll unrolling mode, passes through discharging roller 40 successively, cooling Roller 41, receiving roller 42. The substrate is conveyed from the discharge roller 40 to the take-up roller 42, and the linear speed of the substrate during the production process is 8 m / min. It is dried by the infrared heater 10 and cleaned by the plasma device 11 . The heating temperature of the infrared heater is 120° C., the plasma device 11 is a cathode ion source, the voltage is 500 volts, and the current is 0.5 ampere. The refrigeration temperature of the cryogenic trap 6 is -130°C.

[0031] (2) Vacuum magnetron sputtering method and vacuum evaporation method coating: the pretreate...

Embodiment 3

[0034] A method for preparing a low-profile flexible circuit board material, comprising the following steps:

[0035] (1), pretreatment: it is 100 microns with thickness, and width is 550 millimeters, and the flexible substrate PC film that length is 200 meters is placed in pretreatment room 1, adopts roll-to-roll unrolling mode, passes through discharging roller 40, cooling successively Roller 41, receiving roller 42. The substrate is conveyed from the discharge roller 40 to the take-up roller 42, and the linear speed of the substrate during the production process is 15 m / min. It is dried by the infrared heater 10 and cleaned by the plasma device 11 . The heating temperature of the infrared heater 10 is 100° C., the plasma device 11 is a cathode ion source, the voltage is 300 volts, and the current is 0.2 ampere. The refrigeration temperature of the cryogenic trap 6 is -80°C.

[0036] (2) Vacuum magnetron sputtering method and vacuum evaporation method coating: the pretrea...

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Abstract

A preparation method for a low profile flexible circuit board material includes the following steps of (1) pretreatment, (2) film coating through a vacuum magnetron sputtering method and a vacuum vapor deposition method, and (3) electro-coppering and anti-oxidation treatment. Production equipment for the low profile flexible circuit board material comprises film coating equipment and post-treatment equipment. The film coating equipment comprises a film coating machine body shell which internally forms a pre-treatment chamber, a magnetron sputtering chamber and a vapor deposition chamber from top to bottom after being divided by separating plates. The post-treatment equipment comprises a feeding device, a pre-treatment tank, a first-stage electro-coppering tank, a second-stage electro-coppering tank, a water washing tank, an anti-oxidation treatment tank, another water washing tank, a drying box and a collecting device. The preparation method and production equipment for the low profile flexible circuit board material can effectively improve the adhesion force of a conductive film layer, meet the requirement of products with a high adhesion force requirement, and realize organic combination of magnetron sputtering film coating and vapor deposition film coating.

Description

technical field [0001] The invention relates to the field of electronics industry, in particular to a method for preparing a low-profile flexible circuit board material and production equipment thereof. Background technique [0002] The production methods of flexible circuit board materials include sputtering method, coating method, lamination method and other methods, among which magnetron sputtering method and evaporation method are recognized as environmentally friendly and green methods for producing conductive strips. Evaporation method produces conductive strips with high efficiency but poor metal adhesion, and some products cannot meet the requirements of use; sputtering method produces conductive strips with good metal adhesion but low production efficiency, and sometimes requires thickening of the metal layer to meet the requirements . With the continuous development of science and technology, a single evaporation method or magnetron sputtering method can no longer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C28/02C23C14/56C25D3/38C25D5/48
CPCC23C28/023C23C14/562C25D3/38C25D5/48
Inventor 张燕聪张燕华陈昌服
Owner 福建新嵛柔性材料科技有限公司
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