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Moisturecuring polyurethane hot-melt adhesive suitable for adhering narrow frame of mobile phone, and preparation method of moisturecuring polyurethane hot-melt adhesive

A polyurethane hot-melt adhesive, narrow frame technology, applied in the direction of polyurea/polyurethane adhesives, adhesives, adhesive types, etc., can solve the problems of reducing product fluidity, breaking glue, easily blocking needles, etc., to achieve compatibility Good performance, suitable viscosity and uniform glue

Inactive Publication Date: 2017-05-31
NANTONG GAOMENG NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent CN201310069311.9 invented a new type of catalyst, which can obtain a single-component moisture-curable polyurethane hot-melt adhesive with short curing time and good thermal stability, but its component contains an unsaturated bond Acrylic resin, which reduces the long-term thermal performance and aging resistance of the material, and the compatibility of this resin with the system is not good, and it is easy to break the glue during the sizing process
The single-component moisture-curing polyurethane hot melt adhesive system of patent CN200710053718.7 adds chain extenders and fillers. On the one hand, the addition of chain extenders will greatly increase the viscosity of the system and reduce the fluidity of the product. On the other hand, the fillers It is easy to block the needle, which seriously hinders the implementation of dispensing
Although the invention products related to hot melt adhesives basically have the properties of fast curing speed and high bonding strength, if they are used in the frame bonding of electronic consumer products, especially when the narrow frame of electronic equipment is bonded to the screen , have different defects

Method used

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  • Moisturecuring polyurethane hot-melt adhesive suitable for adhering narrow frame of mobile phone, and preparation method of moisturecuring polyurethane hot-melt adhesive
  • Moisturecuring polyurethane hot-melt adhesive suitable for adhering narrow frame of mobile phone, and preparation method of moisturecuring polyurethane hot-melt adhesive
  • Moisturecuring polyurethane hot-melt adhesive suitable for adhering narrow frame of mobile phone, and preparation method of moisturecuring polyurethane hot-melt adhesive

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preparation example Construction

[0026] The embodiment of the present invention also provides a method for preparing a moisture-cured polyurethane hot-melt adhesive suitable for bonding the narrow frame of a mobile phone, which is used for the above-mentioned hot-melt adhesive, comprising the following steps:

[0027] Step 1, selecting raw materials according to parts by weight, wherein, 30-40 parts by weight of polyether polyol, 20-30 parts by weight of polyester polyol, 10-20 parts by weight of acrylic resin, 0.1-0.2 parts by weight of antioxidant, 0.03 parts by weight of phosphoric acid, 14-20 parts by weight of polyisocyanate, 6-20 parts by weight of tackifying resin, 0.1-1 part by weight of silane coupling agent, and 0.1-0.3 parts by weight of catalyst;

[0028] Step 2, stirring and mixing the polyether polyol, polyester polyol, acrylic resin, antioxidant, phosphoric acid and tackifying resin, heating to 110-130°C, dehydrating for 2 hours under a vacuum degree of less than 100Pa, and then Nitrogen ventin...

Embodiment 1

[0044]This embodiment provides a moisture-curing polyurethane hot-melt adhesive suitable for bonding the narrow frame of a mobile phone, and its preparation method is as follows:

[0045] 35 parts by weight of PPG-2000, 20 parts by weight of polyester polyol, 12 parts by weight of acrylic resin, 0.2 parts by weight of pentaerythritol tetrakis [3-(3',5'-di-tert-butyl-4'-hydroxybenzene base) propionate], and 0.02 parts by weight of phosphoric acid were added to the reaction kettle, dehydrated at 130°C and -0.01MPa for 2h, vented nitrogen, cooled to 85°C, added 11.4 parts by weight of MDI under nitrogen protection, and maintained the temperature At 85°C, react for 2h. exist

[0046] Under nitrogen protection, add 0.2 parts by weight of silane coupling agent KH560 and 0.2 parts by weight of catalyst, stir for 30 minutes, heat up to 100°C, vacuumize to -0.01MPa, remove bubbles for 45 minutes, and heat to 110°C before discharging , airtightly packaged to prepare a polyurethane hot...

Embodiment 2

[0048] 35 parts by weight of PPG-2000, 20 parts by weight of polyester polyol, 15 parts by weight of acrylic resin, 0.2 parts by weight of pentaerythritol tetrakis [3-(3',5'-di-tert-butyl-4'-hydroxy Phenyl)propionate], and 0.02 parts by weight of phosphoric acid were added to the reactor, dehydrated at 130°C and -0.01MPa for 2h, vented with nitrogen, cooled to 85°C, added 12.01 parts by weight of MDI under nitrogen protection, and maintained The temperature was 85°C and the reaction was 2h.

[0049] Under the protection of nitrogen, add 0.2 parts by weight of silane coupling agent KH560 and 0.2 parts by weight of catalyst, stir for 30 minutes, heat up to 100°C, vacuumize to -0.01MPa, remove air bubbles for 45 minutes, and heat to 110°C before discharging. ℃, airtightly packaged to prepare polyurethane hot melt adhesive.

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Abstract

The invention discloses a moisturecuring polyurethane hot-melt adhesive suitable for adhering a narrow frame of a mobile phone, and a preparation method of the polyurethane hot-melt adhesive. The polyurethane hot-melt adhesive is prepared by enabling polyether polyol, polyester polyol and diisocyanate to react, and adding acrylic resin, an antioxidant, tackifying resin, phosphoric acid, a catalyst and a silane coupling agent at the same time to obtain the single-component moisturecuring polyurethane hot-melt adhesive. The moisturecuring polyurethane hot-melt adhesive prepared by using the method disclosed by the invention has adjustable opening time, can be cured fast, and is free of gel and high in mobility during adhesive applying. The moisturecuring polyurethane hot-melt adhesive can be applied smoothly by using a 23# needle under a 110 DEG C heating condition, and is specially suitable for structure assembly in a production line of the narrow frame of the mobile phone.

Description

technical field [0001] The invention relates to the field of preparation of single-component moisture-curing polyurethane hot-melt adhesives, in particular to a moisture-curing polyurethane hot-melt adhesive suitable for bonding narrow frames of mobile phones and a preparation method thereof. Background technique [0002] With the rapid development of the electronics industry, a large number of large-screen, narrow-frame hand-held portable electronic products such as smart phones and tablet computers have entered thousands of households and many enterprises and institutions. In the production lines of these electronic devices, it is necessary to bond the screen to the frame, the front and rear covers to the frame, and the middle frame. Currently, one-component polyurethane hot-melt adhesive is used more often. This hot-melt adhesive is 100% solid content, environmental protection, fast curing speed, strong adhesion, very suitable for their assembly line production and assemb...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/08C09J175/06C09J11/06C09J11/08C08G18/48C08G18/42
CPCC08G18/42C08G18/4825C08L2203/206C08L2205/035C09J11/06C09J11/08C09J175/06C09J175/08C09J2301/304C08L75/06C08L33/00C08L45/00C08L93/04C08K5/1345C08K5/5435
Inventor 龚鸿亮庄英斌郑晖钱俊
Owner NANTONG GAOMENG NEW MATERIAL
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