Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Computer heat dissipation structure

A heat dissipation structure and computer technology, applied in the computer field, can solve problems such as slow heat dissipation, achieve the effects of convenient assembly, accelerated heat exchange speed, and simplified structure

Pending Publication Date: 2017-05-10
程丽丽 +1
View PDF7 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But there is still a problem with this chassis: the air cooling and water cooling are separated and performed separately, resulting in slower heat dissipation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Computer heat dissipation structure
  • Computer heat dissipation structure
  • Computer heat dissipation structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] The following are specific embodiments of the present invention and in conjunction with the accompanying drawings, the technical solutions of the present invention are further described, but the present invention is not limited to these embodiments.

[0038] Such as figure 1 As shown, in the heat dissipation structure of this computer, the computer includes a chassis 1 with a heat dissipation port 1a on the top; as Figure 1 to Figure 4 As shown, the heat dissipation structure is composed of a heat dissipation fan 2, a partition 1b, a bellows 3, a gas gathering box 4, an exhaust fan 5, an exhaust cylinder 6, an exhaust pipe 7, and the like. Wherein, the bellows 3 is made of heat-conducting material, which may be brass, stainless steel, etc., and in this embodiment, preferably, the bellows 3 is made of brass.

[0039] Specifically, the partition 1b is fixed in the case 1, and the partition 1b divides the inner cavity of the case 1 into a cooling chamber 1c and an installa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a computer heat dissipation structure, and belongs to the field of computers. The problem that the existing chassis heat dissipation efficiency is bad is solved. In the computer heat dissipation structure, the computer comprises a chassis with a heat dissipation port at the top; the heat dissipation structure comprises a heat dissipation fan at the heat dissipation port; a partition plate for separating an inner cavity into mutually disconnected cooling cavity and installation cavity is arranged in the chassis; a refrigerant inlet connected with the cooling cavity is arranged at the top of the chassis; a corrugated pipe is vertically arranged in the cooling cavity, an L-shaped exhaust pipe and an air gathering box are fixedly arranged at the bottom of the chassis; an air inlet hole is formed at the top of the air gathering box; the upper end of the corrugated pipe extends out of the cooling cavity, and the lower end of the corrugated pipe is connected with the air inlet hole; the exhaust fan is installed in the air gathering box, and the exhaust fan comprises a barrel-shaped air outlet end; one end of the exhaust pipe is connected with the air outlet end, an exhaust funnel is arranged in the installation cavity, and the other end of the exhaust pipe is connected with the exhaust funnel. The computer heat dissipation structure provided by the invention has the advantage of being capable of improving the heat dissipation efficiency of the chassis.

Description

technical field [0001] The invention belongs to the field of computers and relates to a computer cooling structure. Background technique [0002] With the development of science and technology, computers can handle more and more tasks. When a computer handles large and complex tasks, it generates a huge amount of heat. If this part of the heat is not discharged in time, it will affect the performance of the computer, so the heat dissipation structure was born. [0003] Existing heat dissipation structures such as a computer heat dissipation chassis disclosed in the Chinese Patent Library [Application No.: 201620446521.4] include a box body, which is composed of a top plate, a bottom plate, a front plate, a back plate and two side plates connected frame, the power switch is set on the front panel, the bottom of the front panel is provided with an air inlet, the air inlet is provided with a suction fan, the outer cover of the suction fan is provided with a filter screen, and ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/206G06F2200/201
Inventor 程丽丽
Owner 程丽丽
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com