Rigid-flex board and mobile phone camera module

A technology of soft and hard boards and hard boards, which is applied in image communication, television, color TV, etc., can solve the problems of poor imaging quality of image sensors, and achieve the effects of reducing poor imaging quality, reducing overheating, and reducing height

Inactive Publication Date: 2017-04-05
KUNSHAN Q TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the above-mentioned technical problems, the present invention proposes a soft-rigid combination board and a mobile phone camera module. Under the condition that the TTL of the mobile phone camera module remains unchanged, the height of the entire mobile phone camera module can be reduced, and the PCB plate flatness is reduced. The problem of poor imaging quality caused by the image sensor, and can reduce the problem of overheating of the mobile phone during the normal camera process

Method used

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  • Rigid-flex board and mobile phone camera module
  • Rigid-flex board and mobile phone camera module
  • Rigid-flex board and mobile phone camera module

Examples

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Embodiment Construction

[0023] In order to understand the technical content of the present invention more clearly, the following examples are given in detail, the purpose of which is only to better understand the content of the present invention but not to limit the protection scope of the present invention.

[0024] Such as figure 1 and figure 2 As shown, a rigid-flex board 1 includes a hard board part 11 for the lens, an intermediate soft board part 12 and a hard board part 13 for the connector. A sinking groove 14 is formed at the center of the hard board part of the lens to connect the lens The routing and via holes of the module 2 and the connector 3 are arranged around the sinking tank, and the back of the lens hard board is pasted with a reinforcing metal sheet 15 that closes the bottom opening of the sinking tank. During specific implementation, the position corresponding to the image sensor in the organic soft-hard combination board used on the conventional mobile phone camera module can b...

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Abstract

The invention discloses a rigid-flex board and a mobile phone camera module; a position corresponding to an image sensor in an organic rigid-flex board applied in a normal mobile phone camera module is hollowed, and a reinforcing steel sheet is attached on the backside; the image sensor can be placed in the hollowed sink slot in a wafer bonding process, thus reducing the height of the whole mobile phone camera module without changing the mobile phone camera module TTL; in addition, the image sensor makes contacts with the steel sheet; the flatness of the steel sheet is much better than that of the surface of a PCB board, thus solving the poor imaging quality problems, caused by the flatness of the PCB board, of the image sensor; in addition, the image sensor is a photosensitive chip with large caloric power, the thermal diffusivity FR4 of the steel sheet is much better than the PCB board, so the overheating problems of the mobile phone in a normal shooting process can be reduced.

Description

technical field [0001] The invention relates to the technical field of mobile phone camera modules, in particular to a soft-hard combination board and a mobile phone camera module. Background technique [0002] At present, the rigid-flex PCB (RFPC) structure commonly used in mobile phone camera modules (CCM) is: the surface layer is hard (such as FR4 material), the middle (inner layer) is a flexible circuit board (FPC), and laminated lamination is used. The method is combined together, the surface is etched and the production line is traced (Trace), the hole is formed by drilling a hole, and then placed in a chemical solution for copper plating to make each layer of the circuit conduct through the hole , the surface is covered with ink to form a solder resist layer; since the surface layer uses a hard board and the inner layer uses a soft board, the position of the head and the connector is multi-layered, and the middle part is two layers of soft boards, thus forming a norma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K1/02H04N5/225
CPCH05K1/021H05K1/183H05K2201/2009H04N23/57
Inventor 许杨柳
Owner KUNSHAN Q TECH CO LTD
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