Mobile terminal heat radiation structure and mobile terminal

Abstract

The invention discloses a mobile terminal heat radiation structure and a mobile terminal. The mobile terminal heat radiation structure comprises a heating member, a heat conduction member connected with the heating member, a heat radiation member contacting with the heat conduction member, a fan which is arranged in a mode of corresponding to the heat radiation member and is used for carrying out heat radiation for the heat radiation member, and a control unit electrically connected with the fan, wherein heat of the heating member is conducted through the heat conduction member to the heat radiation member. The heat radiation structure is advantaged in that heat of the heating member can be rapidly radiated, a purpose of improving heat radiation efficiency of the heating member is realized, and thereby heat radiation requirements of large-scale 3D games and high definition videos during applications for the heating member can be satisfied.

Description

technical field [0001] The invention relates to communication technology, in particular to a heat dissipation structure of a mobile terminal and a mobile terminal. Background technique [0002] With the development of smart electronic products, the number of CPU cores is increasing, which better satisfies users' pursuit of large-scale 3D games and high-definition videos. The heat generated by the product is getting bigger and bigger. After the heat is dissipated and acts on the shell of the smart electronic product, it will affect the customer's experience of using the smart electronic product; especially after the popularity of the all-metal body, the heat generated is more likely to spread to the all-metal machine. On the body, consumers are more sensitive to the surface temperature of smart electronic products. [0003] The heat dissipation method of smart electronic products currently used is mainly heat dissipation materials such as graphite and copper foil. Due to the...

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Problems solved by technology

[0003] The heat dissipation method of smart electronic products currently used is mainly heat dissipation materials such as graphite and copper foil. Due to the dense internal components of smart electronic products and the slow air flow, it is difficult to quickly dissipate heat to the outside air in this way; Some high-end smart electronic products use heat pipes and other heat dissipation methods to dissipate heat. This measure mainly dissipates heat by natural convection. However, the heat dissipation efficiency of natural convection is relatively low, and the heat dissipation effect is not ideal.

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