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Motorized spindle with cooling liquid introduced in center for cooling and thinning machine

A technology of coolant and electric spindle, which is applied in the direction of machine tools, circuits, and electrical components suitable for grinding workpiece planes, can solve problems such as electric spindle damage, wafer scrapping, coolant leakage, etc., to improve work reliability, Effect of controlling thermal deformation and working precision

Active Publication Date: 2017-03-15
CETC BEIJING ELECTRONICS EQUIP
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  • Summary
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AI Technical Summary

Problems solved by technology

The electric spindle cooled by the cooling liquid in the center can efficiently and reliably cool the electric spindle when the thinning machine is working, thus effectively solving the problems in the related art that the contact stress of the sealing material of the rotary joint affects the rotation accuracy of the electric spindle and the cooling caused by the failure of the sealing material Fluid leakage can even cause spindle damage and costly wafer scrapping

Method used

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  • Motorized spindle with cooling liquid introduced in center for cooling and thinning machine

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Embodiment Construction

[0039] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0040] Such as figure 1 As shown, the embodiment of the present invention provides an electric spindle cooled by cooling liquid through the center, including: a rotating shaft 12, which is a hollow structure, and a motor rotor 8 is sleeved on it, and the motor rotor 8 and the rotating shaft 12 The connection method is an interference fit, and the rotating shaft 12 is provided with a first cooling liquid passage, and there may be multiple first cooling liquid passages (not shown), and the shape of the first cooling liquid passage of the rotating shaft 12 is a straight hole and / or oblique holes, the axis of the first coolant channel of the rotating shaft 12 is a straight line or a curve; the lower radial bearing 13 is in the shape of a cylinder, in which t...

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Abstract

The embodiment of the invention provides a motorized spindle with a cooling liquid introduced in the center for cooling and a thinning machine, wherein a first cooling liquid channel is arranged on a rotating shaft of the motorized spindle and is used for conveying the cooling liquid and controlling the flow direction of the cooling liquid; meanwhile, an air seal and an overflow channel are arranged on the periphery of the upper end of the rotating shaft of the motorized spindle and are used to prevent the cooling liquid from entering a motor rotor and other adjacent parts when the cooling liquid overflows from the upper end of the first cooling liquid channel under the abnormal conditions. According to the scheme, the motorized spindle is reliably and effectively cooled when the thinning machine works.

Description

technical field [0001] The invention relates to integrated circuit packaging equipment, in particular to an electric spindle and thinning machine cooled by cooling liquid through the center. Background technique [0002] The thinning machine is the key equipment for the post-packaging of integrated circuits, and its function is to planarize and thin the wafer precisely. Thinning machines generally use aerostatic electric spindles as the core executive components to achieve high-precision powerful grinding methods. In this kind of thinning machine, the performance indicators such as the stiffness, rotation accuracy and reliability of the aerostatic electric spindle directly determine the processing quality of the thinning machine. With the rapid development of the integrated circuit manufacturing industry in the direction of high precision and high speed, the quality requirements of wafer thinning are getting higher and higher. [0003] When the thinning machine is working,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B7/22B24B55/03H01L21/67
CPCB24B7/228B24B55/03H01L21/67126
Inventor 贾月明王明权杨宽李战伟李雪
Owner CETC BEIJING ELECTRONICS EQUIP
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