Motorized spindle with cooling liquid introduced in center for cooling and thinning machine

Abstract

The embodiment of the invention provides a motorized spindle with a cooling liquid introduced in the center for cooling and a thinning machine, wherein a first cooling liquid channel is arranged on a rotating shaft of the motorized spindle and is used for conveying the cooling liquid and controlling the flow direction of the cooling liquid; meanwhile, an air seal and an overflow channel are arranged on the periphery of the upper end of the rotating shaft of the motorized spindle and are used to prevent the cooling liquid from entering a motor rotor and other adjacent parts when the cooling liquid overflows from the upper end of the first cooling liquid channel under the abnormal conditions. According to the scheme, the motorized spindle is reliably and effectively cooled when the thinning machine works.

Description

technical field [0001] The invention relates to integrated circuit packaging equipment, in particular to an electric spindle and thinning machine cooled by cooling liquid through the center. Background technique [0002] The thinning machine is the key equipment for the post-packaging of integrated circuits, and its function is to planarize and thin the wafer precisely. Thinning machines generally use aerostatic electric spindles as the core executive components to achieve high-precision powerful grinding methods. In this kind of thinning machine, the performance indicators such as the stiffness, rotation accuracy and reliability of the aerostatic electric spindle directly determine the processing quality of the thinning machine. With the rapid development of the integrated circuit manufacturing industry in the direction of high precision and high speed, the quality requirements of wafer thinning are getting higher and higher. [0003] When the thinning machine is working,...

AI Technical Summary

Problems solved by technology

The electric spindle cooled by the cooling liquid in the center can efficiently and reliably cool the electric spindle when the thinning machine is working, thus effectively solving the problems in the related art that the contact stress of the sealing material of the rotary joint affects the rotation accuracy of the electric spindle and the cooling caused by the failure of the sealing material Fluid leakage can even cause spindle damage and costly wafer scrapping

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