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Multilayered electronic component and manufacturing method thereof

A technology for electronic components and manufacturing methods, which is applied in transformer/inductor components, inductor/transformer/magnet manufacturing, coil manufacturing, etc., and can solve problems such as reduced reliability, weak adhesion of components and printed circuit boards, etc. , to achieve the effect of improving adhesion

Active Publication Date: 2017-03-08
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in conventional inductors, when the external electrodes are formed only on one surface (lower surface) of the laminated body, or only on the side surface and the lower surface in the longitudinal direction, there is a problem that the internal coil part and the external Weakened adhesion between electrodes and between components and printed circuit boards, resulting in reduced reliability

Method used

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  • Multilayered electronic component and manufacturing method thereof
  • Multilayered electronic component and manufacturing method thereof
  • Multilayered electronic component and manufacturing method thereof

Examples

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Embodiment Construction

[0029] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. In addition, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, for clearer description, the shapes and sizes of elements in the drawings may be exaggerated, and elements denoted by the same symbols in the drawings are all the same elements.

[0030] In addition, in order to clearly explain the present invention, in the drawings, parts irrelevant to the description are omitted, and the thicknesses are shown enlarged in order to clearly show a plurality of layers and regions, and constituent elements with the same functions within the scope of the same idea Description will be given...

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Abstract

The present invention discloses to a multilayered electronic component and a manufacturing method thereof. The multilayered electronic component comprises: a multilayer body having a plurality of insulating layers and an internal coil part including first and second lead portions exposed to the outside and disposed on the insulating layers; a first external electrode disposed on a lower surface and one side surface of the multilayer body and connected to the first lead portion; and a second external electrode disposed on a lower surface and the other side surface of the multilayer body and connected to the second lead portion, wherein the first lead portion and the second lead portion have at least one groove, and are exposed in a surface perpendicular to the lower surface of the multilayer body and a multilayered surface.

Description

technical field [0001] The present invention relates to a laminated electronic component and its manufacturing method. Background technique [0002] Inductors, one of electronic components, are representative passive components that form circuits together with resistors and capacitors to eliminate noise, and are used in resonant circuits, filter circuits, etc., using electromagnetic characteristics and capacitors. Combining to increase the signal of a specific frequency band. [0003] In a laminated inductor, a coil pattern is formed on an insulator sheet mainly made of a magnetic material using conductive paste or the like and laminated to form a coil inside a laminated sintered body to realize inductance. [0004] There is known a vertically laminated inductor in which an internal coil is formed in a vertical direction with respect to a substrate mounting surface in order to achieve higher inductance. Compared with a stacked inductor whose internal coils are formed along...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/28H01F27/29H01F41/00H01F41/04H01F41/10
CPCH01F27/2804H01F27/292H01F41/00H01F41/043H01F41/10H01F2027/2809
Inventor 张修逢金汉李尚锺
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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