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Substrate-processing device, substrate-processing method, and computer-readable recording medium on which substrate-processing program has been recorded

A technology for a substrate processing apparatus and a substrate processing method, which is applied to chemical instruments and methods, cleaning methods and utensils, cleaning methods using liquids, etc. , The effect of suppressing the generation of water marks and particles

Active Publication Date: 2017-02-22
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in that case, the following problems arise: the processing time becomes longer, and the productivity of the substrate processing apparatus decreases.

Method used

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  • Substrate-processing device, substrate-processing method, and computer-readable recording medium on which substrate-processing program has been recorded
  • Substrate-processing device, substrate-processing method, and computer-readable recording medium on which substrate-processing program has been recorded
  • Substrate-processing device, substrate-processing method, and computer-readable recording medium on which substrate-processing program has been recorded

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Embodiment Construction

[0043] Hereinafter, specific configurations of a substrate processing apparatus and a substrate processing method according to an embodiment of the present invention will be described with reference to the drawings.

[0044] Such as figure 1As shown, the substrate processing apparatus 1 has an input / output unit 2 at the front end. In the input / output unit 2 , the carrier 4 that accommodates a plurality of (for example, 25) substrates 3 (here, semiconductor wafers) can be input / output. A plurality of carriers 4 are placed on the input / output unit 2 side by side.

[0045] The substrate processing apparatus 1 has a transport unit 5 behind the input and output unit 2 . A substrate transfer device 6 is arranged on the front side of the transfer unit 5 , and a substrate transfer table 7 is arranged on the rear side. In the transport unit 5 , the substrate 3 is transported between any of the carriers 4 placed on the input / output unit 2 and the substrate delivery table 7 using the...

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Abstract

A substrate-processing device is provided with: a substrate rotation unit (11) for causing a substrate (3) to turn while the substrate (3) is held; a processing liquid feeding unit (13) for feeding a processing liquid to the substrate; and a substitution liquid feeding unit for feeding a substitution liquid, which is substituted for the processing liquid fed from the processing liquid feeding unit, to the substrate. When the substitution liquid feeding unit (14) is feeding the substitution liquid to the substrate, the processing liquid feeding unit (13) feeds the processing liquid to a position further on the outer periphery side of the substrate than the position at which the substitution liquid fed from the substitution liquid feed unit is fed onto the substrate, and a liquid film of the processing liquid is formed. The entirety of the surface of the substrate can be kept covered by a liquid film without increasing the amount of the substitution liquid consumed.

Description

technical field [0001] The present invention relates to a substrate processing apparatus for replacing processing liquid on a substrate with a replacement liquid, a substrate processing method, and a computer-readable recording medium in which a substrate processing program is recorded. Background technique [0002] Conventionally, when manufacturing semiconductor components, flat panel displays, etc., various liquid processes such as cleaning and etching have been performed on substrates such as semiconductor wafers and liquid crystal substrates using substrate processing equipment. [0003] For example, in a substrate processing apparatus that cleans a substrate, a chemical solution for cleaning is supplied to a rotating substrate, and the surface of the substrate is cleaned with the chemical solution. Thereafter, a rinse liquid is supplied to the central portion of the substrate, and the surface of the substrate is rinsed with the rinse liquid. In this rinsing process, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304H01L21/027
CPCB08B3/024F26B21/004H01L21/67028H01L21/67051F26B15/04H01L21/02052H01L21/02282H01L21/02307H01L21/67017H01L21/6704H01L21/6715B08B3/08
Inventor 篠原和義吉田祐希
Owner TOKYO ELECTRON LTD
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