Electronic package and fabrication method thereof
A technology for electronic packages and electronic components, which is applied in the manufacture of electrical components, electric solid devices, semiconductor/solid devices, etc., and can solve the problem of increasing the volume of semiconductor packages 1, increasing the surface area of substrates 10, and not conforming to the lightness and thinness of semiconductor packages. issues such as short development trends
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[0043] The implementation of the present invention is described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
[0044] It should be noted that the structures, proportions, sizes, etc. shown in the drawings of this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the conditions for the implementation of the present invention , so it has no technical substantive meaning, and any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of the disclosure of the present invention without affecting the functions and objectives of the present invention. The technical content must be within the scope covered. At the same time, terms such as "above", "first",...
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