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Temperature-resistant epoxy glue for micro/ultra-filtration membrane module pouring

A technology of ultrafiltration membrane and epoxy glue, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of large residual stress, high curing heat release, and cracking of the pouring end surface, so as to reduce the heat of curing reaction , The effect of small reaction heat release and not easy to explode

Active Publication Date: 2017-02-15
BEIJING SCINO MEMBRANCE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a temperature-resistant epoxy glue for casting micro / ultrafiltration membrane components to solve the problems caused by high curing heat release and large residual stress in the casting process of existing micro / ultrafiltration membrane components. Cracking of the pouring end face, and temperature resistance limitations in high-temperature separation fields such as high-temperature condensate water, oilfield reinjection water, and hot water sterilization

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] The base epoxy resin E-51 of 40 parts by weight, the modified epoxy resin TDE-85 of 60 parts and the antifoaming agent of 0.3 parts are mixed and stirred evenly, and defoaming is used as the resin component; 10 parts of m-benzene Dimethylamine condensate and 15 parts of benzyl glycidyl ether were reacted at 60°C for 60 minutes, then 50 parts of T403 were added, mixed and stirred evenly, defoamed, cooled to room temperature, and used as a curing agent component. When in use, mix and stir the resin component and curing agent component according to the ratio of 100:75, then let it stand for defoaming for 5 minutes to obtain epoxy glue. Mixed viscosity 1780mpa.s; pot life ≥ 3h; 100g curing exothermic peak 56°C; ABS-ABS substrate lap shear strength 6.17Mpa; DSC method test Tg 97.1°C.

Embodiment 2

[0021] Mix and stir the basic epoxy resin E-51, 45 parts of modified epoxy resin AG-80 and 0.5 part of defoamer in a weight ratio of 55 parts, and defoam, as a resin component; 10 parts of m-benzene Diamine and 25 parts of benzyl glycidyl ether reacted at 80°C for 30 minutes, then added 20 parts of D230 and 30 parts of D400, mixed and stirred evenly, defoamed, and cooled to room temperature, as a curing agent component. When in use, mix and stir the resin component and the curing agent component according to the ratio of 100:85, and then let it stand for defoaming for 5 minutes to obtain the epoxy glue. Mixed viscosity 1830mpa.s; pot life ≥ 3h; 100g curing exothermic peak 49°C; ABS-ABS substrate lap shear strength 5.89Mpa; DSC method test Tg 91.8°C.

Embodiment 3

[0023] Mix and stir the base epoxy resin E-51, 30 parts of modified epoxy resin AG-80 and 0.4 part of defoamer in a weight ratio of 70 parts, and defoam, as a resin component; 10 parts of m-benzene Dimethylamine and 18 parts of phenyl glycidyl ether were reacted at 70°C for 45 minutes, then added 32 parts of T403 and 10 parts of D230, mixed and stirred evenly, defoamed, and cooled to room temperature, as a curing agent component. When in use, mix and stir the resin component and the curing agent component according to the ratio of 100:70, and then let it stand for degassing for 5 minutes to obtain the epoxy glue. Mixed viscosity 1940mpa.s; pot life ≥ 3h; 100g curing exothermic peak 53°C; ABS-ABS substrate lap shear strength 6.05Mpa; DSC method test Tg 95.2°C.

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Abstract

The invention discloses temperature-resistant epoxy glue for micro / ultra-filtration membrane module pouring and belongs to the technical field of epoxy adhesives. The temperature-resistant epoxy glue comprises a resin component and a curing agent component. A preparation technology includes mixing and stirring basic epoxy resin, modified epoxy resin and a defoaming agent uniformly to obtain the resin component; subjecting an aromatic amine curing agent and phenyl glycidyl ether to pre-reaction according to a specific ratio for 30-60 minutes at 60-80 DEG C, mixing a reactant with a polyether amine curing agent with stirring evenly and decreasing the temperature to the room temperature so as to obtain the curing agent component; mixing and stirring the resin component and the curing agent component according to a weight ratio of 100 to (70-85), standing, defoaming and curing at the room temperature. The temperature-resistant epoxy glue has the advantages of room-temperature curing, moderate mixing viscosity, gentle reaction heat release, high adhesive strength and high temperature tolerance and is applicable to micro / ultra-filtration membrane module pouring in the field of high-temperature separation.

Description

technical field [0001] The invention relates to a temperature-resistant epoxy adhesive for pouring micro / ultrafiltration membrane components, which is suitable for the technical field of epoxy adhesives. Background technique [0002] Micro / ultrafiltration membrane water purification is a new technology with both environmental protection and energy saving. It has high treatment efficiency, good effect and low energy consumption. It is widely used in drinking water treatment, seawater desalination, sewage reuse, industrial wastewater treatment and other fields. [0003] The micro / ultrafiltration membrane module is the core component of the micro / ultrafiltration membrane application, and it is usually sealed with polyurethane glue or epoxy resin glue. The epoxy resin glue used in conventional micro / ultrafiltration membrane module casting is limited by technical conditions, and generally can only be used in a temperature environment within 45°C. Membrane modules are used in an ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/08C08G59/50
CPCC08G59/5033C08G59/504C08L2201/08C08L2205/025C08L2205/03C09J11/08C09J163/00C08L63/00C08L71/00
Inventor 何柳东林亚凯赵杰徐大明王旭宋玉萍
Owner BEIJING SCINO MEMBRANCE TECH
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