Injection molding process method for LED lamp integrally formed through injection molding

Abstract

The invention discloses an injection molding process method for an LED lamp integrally formed through injection molding. The injection molding process method is composed of the following steps that LED lamp beads are attached to a PCB substrate; a cavity of the PCB substrate in the embedment step (A) is reserved in a mold of an injection molding machine, the PCB substrate where the LED lamp beads are well attached is placed in the cavity reserved in the mold, and integral forming injection molding is conducted; and the injection molding method in the step (B) includes the steps that glue injection and glue melting are sequentially conducted on the PCB substrate in the cavity, pressure maintaining is then conducted, mold opening is conducted after cooling, and the period of one time of injection molding ranges from 50 S to 55 S. The injection molding process method is simple in process step, the PCB substrate where the LED lamp beads are well attached can be directly placed in the injection molding machine to be subjected to integral forming injection molding, the LED lamp beads on the PCB substrate in the injection molding process cannot be damaged under the specific parameter condition, the finished product ratio of products is high, the manufacturing material and labor cost can be reduced through integral forming injection molding, capacity of production is improved, and leakproofness of the products is improved.

Description

technical field [0001] The invention relates to the field of lighting equipment, in particular to an injection molding process for an integrally molded LED lamp. Background technique [0002] At present, more and more LED lights are entering people's lives. They have high luminous efficiency, low reflection loss of lamps, energy saving, no need for high voltage, high safety, and long service life. Therefore, LED lights are becoming more and more popular. Into people's daily life; most of the current LED lamps, the LED lamp beads, the substrate and the heat sink are usually separated, so in the later assembly process, it is necessary to spend labor costs to assemble each component, and then the assembly process Among them, the LED lamp beads are pasted on the substrate, and the installation between the substrate and the cooling device directly affects the service life and safety of the LED lamp. The production capacity and quality of the manually assembled LED lamp are diffic...

AI Technical Summary

Problems solved by technology

[0002] At present, more and more LED lights are entering people's lives. They have high luminous efficiency, low reflection loss of lamps, energy saving, no need for high voltage, high safety, and long service life. Therefore, LED lights are becoming more and more popular. Into people's daily life; most of the current LED lamps, the LED lamp beads, the substrate and the heat sink are usually separated, so in the later assembly process, it is necessary to spend labor costs to assemble each component, and then the assembly process Among them, the LED lamp beads are pasted on the substrate, and the installation between the substrate and the cooling device directly affects the service life and safety of the LED lamp. The production capacity and quality of the manually assembled LED lamp are difficult to guarantee, and the lamps and lanterns The sealing performance is also difficult to guarantee, and the assembly space and heat dissipation space of the lamps also need to be large, so as to ensure the normal production and use of LED lamps

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