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a kind of earphone

A technology of earphones and speakers, applied in earpiece/earphone accessories, etc., can solve problems such as complicated process and expensive materials, and achieve the effect of improving timbre, sound field performance, and high-fidelity effect

Active Publication Date: 2019-08-20
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] An embodiment of the present invention provides an earphone to solve the problems of high-fidelity earphones in the prior art, such as expensive materials and complicated processes.

Method used

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Embodiment Construction

[0012] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0013] An embodiment of the present invention provides an earphone. Specifically, the earphone can be a headset or earplugs. The earplugs can be either flat-tip earplugs or in-ear earplugs.

[0014] Such as Figure 1~5 As shown, the earphone includes: a front cover 30 , a speaker 20 and a rear cover 10 . Wherein, both the front cover 30 and the rear cover 10 are made of plastic material, and are molded by injection molding. The front cover 30 and t...

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Abstract

The embodiment of the invention provides a headset. The headset comprises a front cover, a loudspeaker and a rear cover, wherein the front cover and the rear cover are fixedly connected; a cavity is formed between the front cover and the rear cover; the loudspeaker is arranged in the cavity; the front cover comprises a loudspeaker assembly slot, a plurality of sound outlets and a plurality of front cover tuning holes; the loudspeaker assembly slot is formed in the inner surface of the front cover, is ring-shaped and comprises a first side and a second side which are opposite to each other; the surface of the loudspeaker assembly slot is inclined from the first side to the second side, so that the first side is higher than the second side relative to the inner surface of the front cover; the sound outlets are formed in the front cover in a penetrating manner and positioned in the annulus of the loudspeaker assembly slot; the front cover tuning holes are formed in the front cover in a penetrating manner and positioned in the periphery of the loudspeaker assembly slot; the loudspeaker is arranged on the loudspeaker assembly slot, and a rear cavity is formed between the loudspeaker and the rear cover and used for changing the radiation form of acoustic waves entering the rear cavity. Owing to the structural design, two acoustic waves with different radiation angles and phase positions are provided, and the tone quality can be improved.

Description

technical field [0001] The invention relates to the technical field of audio devices, in particular to an earphone. Background technique [0002] With the popularization of portable consumer electronic products, earphones have been widely used in people's daily life, and people are pursuing higher and higher sound quality effects of earphones. However, currently on the market, the high-fidelity Hi-Fi sound quality earphones are relatively expensive, and the middle and low price earphones have different sound quality styles. Users often need to spend a high price to have high-fidelity sound quality headphones. In the existing technology, in order to improve the sound quality of the earphones, especially when the appearance of the earphones is limited, many tuning engineers use better materials and processes, or use multi-unit combinations, which not only increase the sound quality adjustment, material production The difficulty, while increasing the cost of the headset. Co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R1/10
Inventor 冯海彬王志远
Owner VIVO MOBILE COMM CO LTD
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