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OLED display panel and production method and testing method thereof

A technology for display panels and display areas, applied in static indicators, semiconductor/solid-state device manufacturing, instruments, etc., can solve the problems of easy scratches on the edges of metal films, poor dark lines, and circuit scratches

Active Publication Date: 2017-01-04
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the evaporation process, a mask plate is needed, and the mask plate is easy to scratch the circuit on the array substrate located in the peripheral wiring area and close to the edge of the array substrate during the alignment process, resulting in When the panel is performing a lighting test, there is a dark line defect
In addition, when packaging, if metal packaging is used, the edge of the metal film will easily scratch the circuit on the array substrate located in the peripheral wiring area and close to the edge of the array substrate during the alignment process.

Method used

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  • OLED display panel and production method and testing method thereof
  • OLED display panel and production method and testing method thereof
  • OLED display panel and production method and testing method thereof

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] An embodiment of the present invention provides an OLED display panel, such as figure 1 and figure 2 As shown, it includes an array substrate 01 and a packaging cover plate 04. The array substrate 01 includes a display area 02 and a peripheral wiring area 03; the peripheral wiring area 03 includes a circuit 30 arranged on the edge of the array substrate 01, and an Conductive rubber strip 40; the conductive rubber strip 40 extends along the direction o...

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Abstract

An embodiment of the invention provides an OLED display panel and a production method and testing method thereof and relates to the technical field of display. By the production method, circuit scratching during the production of the OLED display panel can be avoided. The OLED display panel comprises an array substrate and an encapsulation cover plate, wherein the array substrate comprises a display area and a peripheral wiring area; the peripheral wiring area comprises circuits arranged at the edge of the array substrate and conductive adhesive strips arranged above the circuits; the conductive adhesive strips extend along the direction of the edge close to the display area; the conductive adhesive strips are conductive in a Z direction and non-conductive on an X plane and a Y plane; the Z direction is vertical to the substrate of the array substrate. The OLED display panel is used for an OLED display device.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an OLED display panel, a preparation method and a testing method thereof. Background technique [0002] Organic Light Emitting Diode (OLED) display is an organic thin film electroluminescent device, which has the advantages of simple preparation process, low cost, easy formation of flexible structure, and wide viewing angle. Therefore, the display technology of OLEDs has become an important display technology. [0003] The OLED display includes an array substrate and a package substrate, and the array substrate includes a thin film transistor (Thin Film Transistor, TFT for short) and an OLED light-emitting device composed of an anode, an organic material functional layer and a cathode. The organic material functional layer needs to be formed by evaporation process. [0004] In the evaporation process, a mask plate is needed, and the mask plate is easy to scratch the circuit on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32H01L51/52G09G3/00
CPCG09G3/006H10K59/131H10K50/841
Inventor 王琳琳王辉锋徐攀
Owner BOE TECH GRP CO LTD
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