Power package with integrated magnetic field sensor

Abstract

The invention provides a power package with an integrated magnetic field sensor. A power semiconductor package includes a substrate having a plurality of metal leads, a power semiconductor die attached to a first one of the leads and a magnetic field sensor integrated in the same power semiconductor package as the power semiconductor die and positioned in close proximity to a current pathway of the power semiconductor die. The magnetic field sensor is operable to generate a signal in response to a magnetic field produced by current flowing in the current pathway, the magnitude of the signal being proportional to the amount of current flowing in the current pathway.

Description

technical field [0001] The present application relates to power semiconductor packages, and in particular, to power semiconductor packages with integrated magnetic field sensors. Background technique [0002] A power package includes one or more power semiconductor dies, such as power transistors and / or power diode dies, attached to a substrate, such as a lead frame or a ceramic substrate with a patterned metallized surface. In each case, accurate current and / or temperature measurements are required to ensure reliable and safe operation of the power package. Some current / temperature sensors are implemented using external components such as resistive shunts that are highly accurate but complicate package design. Other conventional approaches integrate electrical type sensors in power semiconductor dies. This approach reduces the complexity of the package design, but at the expense of reduced accuracy. Typical integrated electrical type sensors such as diodes (whose voltage...

AI Technical Summary

Problems solved by technology

Sensing accuracy can be improved to e.g. + / - 2% by user calibration, but this requires calibration work which adds cost

Images