Printing mechanism for manufacturing semiconductor modules and working method thereof

Abstract

The invention discloses a printing mechanism for manufacturing semiconductor modules and mainly relates to the technical field of semiconductor manufacturing. A clamping jaw air cylinder is fixed to a machine rack panel through a clamping jaw air cylinder seat; a pair of letter printing clamping jaws is arranged at the front end of the clamping jaw air cylinder; a laser printer is fixed to the machine rack panel through a printer bottom board; a detecting device, a display panel and an emergency shut-down button are arranged on the surface of the laser printer; the detecting device is connected with the display panel; and the detecting device comprises a temperature sensor, a humidity sensor and a smoke sensor. The whole structure of the printing mechanism and the operation process of the printing mechanism are very simple, maintenance is fast and convenient, cost is low, printing efficiency is high, the operation state of the printing mechanism can be conveniently monitored by operators, and long-term, efficient and stable operation can be ensured. The invention further discloses a working method of the printing mechanism for manufacturing the semiconductor modules.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a printing mechanism for manufacturing semiconductor modules and a working method of the printing mechanism. Background technique [0002] The semiconductor module is a device that produces stimulated emission by using a certain semiconductor material as a working substance, and is a part of the semiconductor laser. [0003] In recent years, with the continuous development of science and technology, related industries have higher and higher technical requirements for semiconductor modules. However, the existing printing mechanism for manufacturing semiconductor modules still has the following defects: [0004] 1. The overall structure and operation process of the printing mechanism are very complicated, and the load requirements are high, the maintenance is very cumbersome, and the manufacturing and operating costs are high; [0005] 2. The degree of automa...

AI Technical Summary

Problems solved by technology

[0004] 1. The overall structure and operation process of the printing mechanism are very complicated, and the load requirements are high, the maintenance is very cumbersome, and the manufacturing and operating costs are high;

[0005] 2. The degree of automation is low, the operation of personnel is complicated, and the printing efficiency is low;

[0006] 3. Operators cannot monitor its running status in real time, and deviations and failures are prone to occur during the printing process;

[0007] 4. The overall security is poor, and it cannot respond in time when an unexpected situation occurs, and cannot guarantee the long-term efficient and stable operation of the printing work

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