Cutting device

Abstract

According to the present invention, there is provided a cutting device capable of maintaining an appropriate indentation amount of a cutting bar without being affected by the thickness of a semiconductor substrate, a protective film, and a dicing tape. The cutting device presses the cutting bar (7) into a semiconductor substrate (W) having a scribe line (S) on the surface to divide the substrate, one side of the semiconductor substrate (W) is covered with a protective film (3), and a dicing tape (2) is attached to the opposite side. The structure of the cutting device includes a workbench (4) for placing the semiconductor substrate (W) together with the protective film (3) and the dicing tape (2); a displacement gauge (10) for measuring the surface height of the protective film (3) or the dicing tape (2) placed on the upper surface side of the semiconductor substrate (W) of the workbench (4), and a computer (C) control part (11) that subtracts the displacement amount to the specified indentation amount of the cutting bar (7) to enable the cutting bar (7) to be lifted and lowered under the condition that the measured value obtained by the displacement gauge (10) has displacement relative to the pressing starting position of the cutting bar (7).

Description

technical field [0001] The invention relates to a cutting device for a semiconductor substrate made of brittle materials such as glass, silicon and ceramics. In particular, the present invention relates to a cutting device for cutting out unit products such as chips by dividing a semiconductor substrate along scribe lines processed on its surface. Background technique [0002] Usually, in the process of cutting out chips from a semiconductor substrate as a mother board, first, a knife wheel and a laser are used to scribe along a predetermined scribe line on the surface of the semiconductor substrate, thereby forming mutually orthogonal X and Y directions. Score lines (cracks). Thereafter, the semiconductor substrate is divided into square chips by pressing the cutting bar from the surface opposite to the scribed line with a cutting device to bend the substrate (see Patent Document 1 and Patent Document 2). [0003] Such as figure 1 As shown in (a), semiconductor substrate...

AI Technical Summary

Problems solved by technology

[0011] When dividing with a cutting bar, if the pressing amount of the cutting bar into the substrate is large, the bending of the substrate will increase and the edges of the split ends will come into contact with each other, resulting in chipping at the split end face, or damage to the protective film. Substrate surface

Also, on the contrary, if the amount of pressing is small, problems such as undivided parts will occur due to insufficient bending of the substrate, so it is necessary to ensure an appropriate amount of pressing for cutting the strip.

[0012] However, the appropriate range of the above press-in amount is narrow, for example, for a semiconductor substrate W with a thickness of 1 mm, the range is 200 to 300 μm, and since this value is small, adjustment is troublesome.

In addition, when the thickness of the semiconductor substrate W, the dicing tape 2, and the protective film 3 deviates from the predetermined thickness, the pressing start position of the cutting bar 7' will be different from the surface contacting the dicing tape 2 and the protective film 3. Therefore, the amount of pressing into the semiconductor substrate W will increase or decrease unnecessarily, and perfect division cannot be achieved.

Images