Totally-enclosed case heat radiation device

A heat dissipation device and fully enclosed technology, which is applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems that the protection level of the chassis cannot be achieved, and the sealing of the chassis cannot be achieved, so as to achieve good cooling effect, strengthen the sealing, and prevent dust from entering.

Active Publication Date: 2016-12-14
FUJIAN XINGHAI COMM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the heat inside the chassis is transferred to the outside of the chassis through the heat pipes arranged inside and outside the chassis, the heat pipes connect the interior of the chassis with the outside of the chassis, and cannot completely seal the chassis, and the protection level of the chassis cannot reach IP6

Method used

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  • Totally-enclosed case heat radiation device
  • Totally-enclosed case heat radiation device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Please refer to Figure 1 to Figure 2 , Embodiment 1 of the present invention is:

[0035] A heat dissipation device for a fully enclosed cabinet, comprising a semiconductor cooling fin 1, a heat sink 2, a first coil splint 3, a second coil splint 4, a coil 5, and a miniature vacuum, the heat dissipation surface of the semiconductor cooling fin 1 is fixed On the side plate 9 of the fully enclosed cabinet of the peripheral, the heat dissipation surface of the semiconductor cooling fin 1 is connected with the heat sink 2, and the heat sink 2 is fixed on the outer surface of the side plate 9 of the cabinet; The first coil splint 3 is arranged opposite to the second coil splint 4, and the opposite surfaces of the first coil splint 3 and the second coil splint 4 are paired with a shape suitable for the coil 5. groove 31, the first coil splint 3 and the second coil splint 4 clamp the coil 5, and the first coil splint 3 is fixed on the side plate 9 of the chassis On the inne...

Embodiment 2

[0036] Please refer to Figure 1 to Figure 2 , the second embodiment of the present invention is:

[0037] A heat dissipation device for a fully enclosed chassis, on the basis of Embodiment 1, further includes a connecting sleeve 7 and a heat-conducting silica gel 8, one end of the connecting sleeve 7 is connected to the air outlet of the miniature vacuum pump 6, and the other end is connected to the air outlet of the micro vacuum pump 6. The air inlet of the coil 5 is connected; the opposite surfaces of the first coil splint 3 and the second coil splint 4 are provided with grooves 31 adapted to the radius shape of the coil 5, so A part of the coil 5 is fixed between the first coil splint 3 and the second coil splint 4, and the other part is located outside the first coil splint 3. The coil 5 is a copper pipe, so The first coil splint 3 and the second coil splint 4 are copper plates, and the air outlet of the coil 5 faces upwards; the heat-conducting silica gel 8 is fixed bet...

Embodiment 3

[0038] Please refer to Figure 1 to Figure 2 , Embodiment three of the present invention is:

[0039]A heat dissipation device for a fully enclosed chassis, on the basis of Embodiment 2, further includes a temperature sensor, the temperature sensor is located in the middle of the peripheral chassis, and the air outlet of the coil 5 faces the power amplifier in the peripheral chassis heat sink. A controller is arranged in the casing of the peripherals, and the temperature sensor, the semiconductor cooling chip 1 and the miniature vacuum pump 6 are all connected with the controller in the casing of the peripherals. When the heat sink works, the temperature threshold is preset, and the actual temperature inside the chassis is detected by a temperature sensor. If the actual temperature is lower than or equal to the temperature threshold, the semiconductor refrigeration chip 1 and the miniature vacuum pump 6 are not turned on; if the actual temperature is higher than the temperatu...

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PUM

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Abstract

The invention provides a totally-enclosed case heat radiation device comprising semiconductor refrigeration sheets, heat radiation fins, a first coil pipe clamp plate, a second coil pipe clamp plate and a coil pipe. The heat radiation surface of the semiconductor refrigeration sheets is fixed on the side plate of a peripheral totally-enclosed case and also connected with the heat radiation fins. The heat radiation fins are fixed on the external side surface of the side plate of the case. The first coil pipe clamp plate and the second coil pipe clamp plate are oppositely arranged. The opposite surfaces of the first coil pipe clamp plate and the second coil pipe clamp plate are provided with grooves adaptive to the shape of the coil pipe in a pairing way. The first coil pipe clamp plate and the second coil pipe clamp plate clamp the coil pipe. The first coil pipe clamp plate is fixed on the internal side surface of the side plate of the case and connected with refrigeration surface of the semiconductor refrigeration sheets. Heat radiation of the totally-enclosed case is performed through the semiconductor refrigeration sheets and the coil pipe connected with the semiconductor refrigeration sheets without influencing the sealing performance of the case.

Description

technical field [0001] The invention relates to the technical field of chassis heat dissipation, in particular to a heat dissipation device for a fully enclosed chassis. Background technique [0002] There are a lot of electronic components installed in the chassis. When working, these electronic components themselves will generate heat. However, for the chassis with high sealing requirements, especially the occasions requiring IP64 or above, the chassis needs to have a dust-proof function that completely prevents dust from intruding. , and has a waterproof function to prevent the intrusion of splashing water. At present, there are not many heat dissipation measures in the fully sealed chassis, which leads to an excessively high temperature inside the chassis, which will affect the performance of electronic components. [0003] The Chinese utility model patent with the publication number CN201138461Y discloses a heat pipe cooling device for a fully sealed chassis, including...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20
Inventor 刘开进林道杰郑振端邹清顺苏坤毅洪金泽余东升李小霞
Owner FUJIAN XINGHAI COMM TECH
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