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Flexible substrate, preparation method of flexible substrate and flexible display device

A flexible substrate and flexible packaging technology, which is applied in the directions of identification devices, climate sustainability, and final product manufacturing, can solve the problems of low process precision of rigid auxiliary substrate display devices, reduce the risk of warping, improve process precision, The effect of reducing the expansion coefficient

Pending Publication Date: 2016-12-07
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The object of the present invention is to provide a flexible substrate and its preparation method, and a flexible display device, which are used to solve the technical problem of low process precision in the preparation of display devices due to the easy warpage of the rigid auxiliary substrate

Method used

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  • Flexible substrate, preparation method of flexible substrate and flexible display device
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  • Flexible substrate, preparation method of flexible substrate and flexible display device

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Embodiment Construction

[0026] In order to further illustrate the flexible substrate provided by the embodiments of the present invention, its manufacturing method, and the flexible display device, a detailed description will be given below in conjunction with the accompanying drawings.

[0027] see figure 1 The flexible substrate 20 provided by the embodiment of the present invention includes a first organic layer 21 and an inorganic buffer layer 22 stacked in sequence, and the first organic layer 21 and the inorganic buffer layer 22 form an organic-inorganic composite structure. Specifically, when preparing the flexible substrate 20, the first organic layer 21 is first formed on the rigid auxiliary substrate 10, and then the surface of the first organic layer 21 facing away from the rigid auxiliary substrate 10 can be cleaned and activated, for example, by plasma treatment The surface of the first organic layer 21 facing away from the rigid auxiliary substrate 10 is cleaned and activated, and then ...

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Abstract

The invention relates to the technical field of display and discloses a flexible substrate, a preparation method of the flexible substrate and a flexible display device to solve the technical problems that as a rigid auxiliary substrate is prone to warping, the process precision is low when a display device is prepared. The flexible substrate comprises a first organic layer and an inorganic buffer layer which are sequentially stacked. An organic-inorganic composite structure is formed by the first organic layer and the inorganic buffer layer. The expansion coefficient of the inorganic buffer layer is smaller than the expansion coefficient of the first organic layer. Under the interaction of the first organic layer and the inorganic buffer layer which form the organic-inorganic composite structure, the expansion coefficient of the flexible substrate is reduced; the expansion coefficient of the flexible substrate is matched with the expansion coefficient of the rigid auxiliary substrate better, the risk that the rigid auxiliary substrate warps is reduced, and the process precision is increased when the display device is prepared. The flexible substrate is applied to the flexible display device.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a flexible substrate, a preparation method thereof, and a flexible display device. Background technique [0002] A display device is a device used to display text, numbers, symbols, pictures, or images formed by a combination of at least two of the text, numbers, symbols, and pictures. At present, display devices can be divided into rigid display devices and flexible display devices. Among them, flexible display devices have the advantages of good impact resistance, strong shock resistance, light weight, small size and easy portability, and have attracted widespread attention. . [0003] A flexible display device usually includes a flexible substrate, a display device formed on the flexible substrate, and a flexible encapsulation layer for encapsulating the display device. When preparing a flexible display device, the flexible substrate is first formed on a rigid auxiliary subs...

Claims

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Application Information

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IPC IPC(8): H01L51/00H01L51/56
CPCG09F9/33G09F9/301B82Y30/00B82Y40/00H10K59/12H10K71/80H10K77/111H10K2102/311H10K71/00Y02E10/549Y02P70/50H10K50/844H10K59/00
Inventor 王和金谢明哲周伟峰高山镇王大巍
Owner BOE TECH GRP CO LTD
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