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High-precision laser hole overlapped abutting joint method for producing circuit board

A laser hole, high-precision technology, used in printed circuits, printed circuit manufacturing, electrical components, etc., can solve problems such as production troubles, low production efficiency, and difficult operations, so as to avoid low production efficiency, improve production quality, and avoid The effect of identifying errors

Active Publication Date: 2016-11-30
BOMIN ELECTRONICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the production process of the printed circuit board industry, the butt production of laser hole stacking in any layer interconnection board is the future development trend. There will always be poor docking in the docking, resulting in low production efficiency, low yield, and difficult operation. Usually, the inner core board is used to design the X-RAY target, and the X-RAY target machine is used after lamination to punch through holes according to the inner layer target. Carry out laser hole positioning production, or reduce the size of the working board on this basis to improve the alignment accuracy of the laser hole stacking holes, and use the X-RAY machine to drill through holes and position the accumulative accuracy error. On this basis, reducing the size of the working board can improve Laser hole stacking alignment accuracy, but the production efficiency is low, and the laser hole docking accuracy is not ideal, which brings great production troubles and is a common technical problem in the industry

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] First, the circuit board completes conventional drilling positioning holes, copper reduction and browning, laser drilling, and hole filling and electroplating on the inner core board. Taking a 10-layer 4th-order arbitrary layer interconnection board as an example, the specific implementation method is as follows:

[0026] (1) Design four sets of circuit targets at the corners of the four boards of the L56 circuit layer. The inner circle diameter of the line target is 0.4mm, and the outer circle diameter is 2mm. The first group of line targets is 70mm away from the short side and 10mm away from the long side. The second group of line targets is 3mm away from the first group of targets. Similarly, the third group of line targets is 3mm away from the second group of targets. Make 4 sets of line targets in turn.

[0027] (2) Lamination of the L47 layer is completed, and the first through hole is drilled with an X-RAY shooting machine, and then the edge, copper reduction and ...

Embodiment 2

[0034] First, the circuit board completes conventional drilling positioning holes, copper reduction and browning, laser drilling, and hole filling and electroplating on the inner core board. Taking an 8-layer and 3-level arbitrary layer interconnection board as an example, the specific implementation method is as follows:

[0035] (1) Design four sets of circuit targets at the corners of the four boards of the L45 circuit layer. The inner circle diameter of the line target is 0.8mm, and the outer circle diameter is 5mm. The first group of line targets is 60mm away from the short side and 8mm away from the long side. The second group of line targets is 15mm away from the first group of targets. Similarly, the third group of line targets is 15mm away from the second group of targets. Make 4 sets of line targets in turn.

[0036] (2) Lamination of the L36 layer is completed, and the first through hole is drilled with an X-RAY shooting machine, and then the edge, copper reduction a...

Embodiment 3

[0043] First, the circuit board completes conventional drilling positioning holes, copper reduction and browning, laser drilling, and hole filling and electroplating on the inner core board. Taking a 10-layer 4th-order arbitrary layer interconnection board as an example, the specific implementation method is as follows:

[0044] (1) Design four sets of circuit targets at the corners of the four boards of the L56 circuit layer. The inner circle diameter of the line target is 0.6mm, and the outer circle diameter is 3mm. The first group of line targets is 70mm away from the short side and 10mm away from the long side. The second group of line targets is 10mm away from the first group of targets. Similarly, the third group of line targets is 10mm away from the second group of targets. Make 4 sets of line targets in turn.

[0045] (2) Lamination of the L47 layer is completed, and the first through hole is drilled with an X-RAY shooting machine, and then the edge, copper reduction an...

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PUM

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Abstract

The invention discloses a high-precision laser hole overlapped abutting joint method for producing a circuit board, belonging to the technical field of production of circuit boards. The technical key points in the invention comprise the following steps of: (1), manufacturing a circuit target on an inner core plate; (2), respectively and sequentially pressing a semi-solidified sheet and a copper foil on two side plate surfaces of the inner core plate, punching a first through hole, and then, sequentially performing copper inhibiting and brownification treatment; (3), burning to form a second through hole corresponding to the circuit target on the semi-solidified sheet and the copper foil through laser by taking the first through hole as a positioning coordinate; (4), manufacturing laser holes on a single panel by taking the circuit target as a reference coordinate when laser punching is carried out; and (5), repeating the step (2) to the step (4), manufacturing the laser holes layer by layer always by taking the circuit target on the inner core plate as the reference coordinate, and finally, manufacturing multi-stage any-layer interconnection plates. The high-precision laser hole overlapped abutting joint method for producing the circuit board provided by the invention is high in processing efficiency, low in cost and simple and convenient to operate; and the high-precision laser hole overlapped abutting joint method is used for producing the circuit board.

Description

technical field [0001] The invention relates to a circuit board processing method, more specifically, to a high-precision laser hole-stacked-hole butt joint method for circuit board production. Background technique [0002] In the production process of the printed circuit board industry, the butt production of laser hole stacking in any layer interconnection board is the future development trend. There will always be poor docking in the docking, resulting in low production efficiency, low yield, and difficult operation. Usually, the inner core board is used to design the X-RAY target, and the X-RAY target machine is used after lamination to punch through holes according to the inner layer target. Carry out laser hole positioning production, or reduce the size of the working board on this basis to improve the alignment accuracy of the laser hole stacking holes, and use the X-RAY machine to drill through holes and position the accumulative accuracy error. On this basis, reduci...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0047H05K2203/107
Inventor 常选委陈世金韩志伟邓宏喜李云萍徐缓
Owner BOMIN ELECTRONICS CO LTD
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