Method for realizing degradation of stacked IC defective products through cutting break line of package body

Abstract

The invention discloses a method for realizing the degradation of stacked IC defective products through cutting the break line of a package body. the method comprises the steps of packaging an outline drawing, an internal weld line drawing, an IC, a die, a metal line, a blade and a scribing machine, wherein the IC is of a multi-layer structure; figuring out a problematic layer die among the internal multi-layer structure of the IC through testing; determining the feeding position of the blade and setting parameters; putting a to-be-cut IC onto the cutting disc of the scribing machine with the vacuum adsorption function by means of the scribing machine for cutting wafers in order to meet the requirements on the cutting precision; cutting to obtain IC particles; cleaning and drying particles in the scribing machine, and testing rest dies after the cleaning and drying process, wherein the ICs of rest dies without problems are adopted as degraded products. According to the technical scheme of the invention, scrapped ICs are degraded and used based on the physical damage isolation method. Therefore, the income is increased, and waste is reduced.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit packaging, and discloses a method for realizing the degradation of stacked IC defective products by cutting and breaking wires in the package. Background technique [0002] In order to increase capacity and increase functions of IC packaging, multi-die (wafer chip) packaging is generally used, which includes multiple die packages placed in parallel and stacked die packages, wherein the number of die stacked layers ranges from 2 to The 16 layers vary. Of course, there are also the same type of die stacked package and different types of die stacked package, so that the higher the integration level, the easier it is for IC users to use; the application of multiple die packages has obvious advantages, but the packaging yield will be lower than For the package of a single die, the ratio of defective products increases exponentially according to the number of superimposed dies. Simply put, a ...

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Problems solved by technology

[0003] In order to solve the problem in the prior art that one of the multiple dies is damaged or malfunctions causing the entire IC to be scrapped, the present invention discloses that the cutting position of the die is determined accurately through calculation, so that the cutting position of the die is accurate and the waste of the die is avoided ;Release scrapped ICs through physical damage isolation method, increase revenue and reduce waste, and realize the method of downgrading defective products of stacked ICs by cutting and disconnecting packages

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