Semiconductor refrigeration system

Abstract

The invention discloses a semiconductor refrigeration system. The semiconductor refrigeration system comprises a refrigeration chip, a heat end radiator and a heat end fan; the refrigeration chip includes a P / N couple pair, an electric conducting electrode, a cold end substrate and a heat end substrate; the cold and heat end substrates adopt aluminum substrates; at least one couple crystal grain in the P / N couple pair is manufactured by a mechanical pressurizing process; the heat end substrate is provided with a mounting part larger than the cold end substrate; and the heat end substrate is joined with the radiator through a fixed bolt. The semiconductor refrigeration system adopts the aluminum substrates to solve the problem of easy brittleness in traditional ceramic. The semiconductor refrigeration system presses the grains, improves the grain rigidity, is more suitable for vehicle-mounted use environments, and improves the pressure resistance of chips through a four-corner stand column structure.

Description

technical field [0001] The invention relates to the technical field of refrigeration, and more specifically relates to a semiconductor refrigeration system. Background technique [0002] With the development of science and technology and the continuous improvement of people's living standards, the functions that automotive equipment can achieve are becoming more and more diverse, such as on-board computers, which will generate heat during use. At present, due to the small size of the semiconductor refrigeration system, the installation The advantages of easy portability, ideal cooling efficiency, and good reliability, the IC radiator of the vehicle-mounted computer in the prior art usually adopts a semiconductor refrigeration system. During the bumpy driving of the vehicle, the vibration will generate shear force inside the chip, and it is also prone to cracking of the ceramic substrate and particle breakage, resulting in the failure of the radiator. Contents of the invent...

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Problems solved by technology

[0002] With the development of science and technology and the continuous improvement of people's living standards, the functions that automotive equipment can achieve are becoming more and more diverse, such as on-board computers, which will generate heat during use. At present, due to the small size of the semiconductor refrigeration system, the installation The advantages of easy portability, ideal cooling efficiency, and good reliability, the IC radiator of the vehicle-mounted computer in the prior art usually adopts a semiconductor refrigeration system. The risk of cracking. During the bumpy driving of the vehicle, the vibration will generate shear force inside the chip, and it is also prone to cracking of the ceramic substrate and particle breakage, resulting in the failure of the radiator.

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