P electrode structure of LED chip, LED chip structure and manufacturing method therefor

Abstract

The invention discloses a P electrode structure of an LED chip, an LED chip structure and a manufacturing method therefor. The P electrode is formed by multiple layers of metals, wherein Al is at the lowest layer; the LED chip structure comprises a substrate, an N type layer, an active layer, P type layer, an ITO transparent conductive layer, a P electrode and an N electrode; the N type layer, the active layer and the P type layer are formed on the substrate in sequence; the N type layer is connected with the N electrode; the ITO transparent conductive layer is formed on the P type layer; the P electrode is formed on the ITO transparent conductive layer, wherein the metal Al is arranged on the lowest layer of the P electrode; and Al is heated and permeated to the ITO transparent conductive layer, so that schottky contact is formed between the ITO transparent conductive layer and the P type layer. According to the P electrode structure of the LED chip, the LED chip structure and the manufacturing method therefor, the luminous reflectance of the electrode is improved; the luminance of the LED chip is improved; and the manufacturing process for the LED chip is simpler.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a P electrode structure of an LED chip, an LED chip structure and a manufacturing method thereof. Background technique [0002] The conventional chip structure of LED includes the following five steps: Mesa, CB, TCL, Pad, PV. Among them, the CB (current blocking) layer is often used as an insulating material such as silicon oxide or nitride. Although this type of material can form a very good insulating layer to achieve the purpose of current blocking, due to the limitation of the nature of the material itself, the CB layer is often broken during the chip packaging and wiring process, resulting in chip electrodes falling off. Phenomenon. [0003] Conventional front-mount LED chip electrodes are distributed on the front of the chip, which is the same as the light-emitting surface of the chip. Since the electrodes are opaque, they have a great impact on the quantum efficiency outsid...

AI Technical Summary

Problems solved by technology

However, the introduction of Cr also brings a strong light absorption effect, resulting in the reflectivity of the entire reflective electrode being only about 70%, which limits the improvement of chip brightness.

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