Infrared detection picture element structure, manufacturing method therefor and hybrid imaging device

Abstract

The invention provides an infrared detection picture element structure, a manufacturing method therefor and a hybrid imaging device. Upper and lower pole plates having a comb structure can be used for forming a capacitor structure, and one end of an upper electrode structure cannot be fixed; when an infrared sensitive structure in the upper electrode structure absorbs infrared light so as to generate heat stress, deformation is caused, change of capacitance between the upper and lower pole plates is caused, infrared detection can be realized, device sensitivity can be improved, the infrared detection picture element structure can be applied to an infrared light and visible light hybrid imaging device, visible imaging and infrared imaging on the same silicon substrate can be realized, and imaging quality can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an infrared detection pixel structure and a preparation method thereof, and a hybrid imaging device. Background technique [0002] With the wide application of imaging monitoring systems in daily life, monitoring systems that only use 300nm-900nm visible light band imaging are increasingly unable to meet the monitoring requirements of environments such as nighttime or high dynamic changes. Imaging of optical signals outside the band, especially long-wave bands (including signals in infrared, THZ and other bands); [0003] In the prior art, two imaging chips with different wavelength bands and two sets of optical paths are used to realize visible light imaging and long-wave band signal imaging respectively, and they are combined through computer algorithm processing. Due to the inconsistency of optical paths and the corresponding error of a single imaging unit, there will ...

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Problems solved by technology

[0003] In the prior art, two imaging chips with different bands and two sets of optical paths are used to realize visible light imaging and long-wave band signal imaging respectively, and they are synthesized together through computer algorithm processing. Due to the inconsistency of optical paths and the corresponding error of a single imaging unit, there will be Causes a large deviation in the composite image, which seriously affects the imaging quality and monitoring effect; in addition, due to the low sensitivity of this imaging device, it further leads to a decline in imaging quality

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