Insulation board for composite heat insulation of inorganic organic material, preparation method and application thereof

Abstract

The invention discloses an inorganic and organic material composite heat insulation board, a preparation method and application. The heat insulation board sequentially comprises an inorganic base plate, a high polymer attaching membrane, deep layer aluminum foil and a high polymer protecting membrane from bottom to top. The inorganic base plate is a magnesium oxychloride plate added with high-alumina cement or a magnesium oxysulfate plate added with silica fume. The heat insulation board is used for roof heat insulation and partition heat insulation in industrial plants through sunlight reflection of the deep layer aluminum foil and the heat insulation effect of the inorganic base plate. In addition, the inorganic base plate is resistant to water and stable in physical performance, and the inorganic and organic material composite heat insulation board is not corroded after applied under complex temperature conditions on roofs for a long term, and further has a fire resistance and inflaming retarding function.

Description

technical field [0001] The invention relates to the field of chemical building materials, in particular to an inorganic-organic material composite thermal insulation board, a preparation method and application thereof. Background technique [0002] Existing composites of inorganic and organic materials can only be molded under normal temperature conditions, so various rubber materials must be used to complete the interface bonding of inorganic and organic materials. The bonding of the interface in this way has low tensile strength and is not The obvious defects of water resistance and aging resistance make the composite materials of these two materials can only be used in indoor and other environments with relatively stable temperature, and cannot be used outdoors, especially the heat insulation of the roof, because the roof is exposed to sunlight for a long time. , often soaked in rainwater and covered with snow, its application conditions are more complex and changeable, a...

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Problems solved by technology

[0004] In view of the above deficiencies in the prior art, the purpose of the present invention is to provide a thermal insulation board made of inorganic-organic material composite heat insulation and its preparation method and application, aiming at solving the problem that the existing inorganic-organic composite material can only be used indoors and the temperature is relatively stable. problems in the environment