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Electrostatic bonding apparatus and method for generating electrostatic bonding

A technology of electrostatic bonding and equipment, which is applied in the field of electrostatic bonding equipment and electrostatic bonding, and can solve problems such as inability to complete

Inactive Publication Date: 2017-11-10
INST OF ACOUSTICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, when preparing MEMS alkali metal atomic bubbles, the alkali metal needs to be dropped into a silicon wafer with silicon holes and a glass sheet in a clean environment isolated from oxygen and water vapor, and then covered with a glass sheet for electrostatic bonding. Existing equipment cannot complete this operation

Method used

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  • Electrostatic bonding apparatus and method for generating electrostatic bonding
  • Electrostatic bonding apparatus and method for generating electrostatic bonding
  • Electrostatic bonding apparatus and method for generating electrostatic bonding

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Embodiment Construction

[0031] The technical solutions of the present invention will be described in further detail below with reference to the accompanying drawings and embodiments.

[0032] The electrostatic bonding equipment of the present invention can not only complete the electrostatic bonding operation on the operating object, but also provide the operating object with a clean operating environment isolated from oxygen and water vapor.

[0033] figure 1 A perspective view of an electrostatic bonding device provided by an embodiment of the present invention. Such as figure 1 As shown, the electrostatic bonding equipment mainly includes electrostatic bonding generation equipment 1000, glove box equipment 0000, connection channel 0002 between the glove box and the electrostatic bonding chamber, and equipment support frame 0009.

[0034] The electrostatic bonding generating device 1000 is used to complete the electrostatic bonding of the operation object. Glove box equipment 0000 is used to pro...

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Abstract

The invention relates to an anodic bonding device and an anodic bonding generation method. The device comprises a glove box device (0000) and an anodic bonding generation device (1000), the anodic bonding generation device (1000) is internally provided with an anodic bonding chamber, and the glove box device (0000) is internally provided with a glove box; a connection channel (0002) is arranged between the anodic bonding chamber and the glove box, and the connection channel (0002) is used for implementing internal transfer of operating objects. According to the anodic bonding device and the anodic bonding generation method, the glove box and the anodic bonding chamber are connected together through the connection channel, cleanliness of the whole operating environment is guaranteed, the operating environment is guaranteed to be isolated from oxygen and water vapor, and a problem that the objects which are anaerobic and susceptible to the water vapor are in contact with the oxygen and the water vapor in an operating and transportation process is avoided.

Description

technical field [0001] The invention relates to an electrostatic bonding technology, in particular to an electrostatic bonding device and a method for generating electrostatic bonding. Background technique [0002] Electrostatic bonding, also known as Anodic Bonding, Field-Assisted Bonding or Mallory, was discovered by Wallis&Pòmerantz in 1969 and is mainly used for bonding silicon and glass. [0003] Electrostatic bonding has many advantages: (1) low electrostatic bonding temperature, (2) good air tightness of electrostatic bonding, (3) high mechanical strength of electrostatic bonding, and so on. [0004] However, when preparing MEMS alkali metal atomic bubbles, the alkali metal needs to be dropped into a silicon wafer with silicon holes and a glass sheet in a clean environment isolated from oxygen and water vapor, and then covered with a glass sheet for electrostatic bonding. Existing equipment cannot do this. Contents of the invention [0005] The purpose of the pres...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C3/00
CPCB81C3/001
Inventor 汤亮张忠山季磊支萌辉齐敏孙泉乔东海张倩
Owner INST OF ACOUSTICS CHINESE ACAD OF SCI
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