High-speed hard-soft combining plate with soft areas of different lengths and manufacturing method thereof

A technology of soft-rigid combination board and manufacturing method, which is applied in the direction of printed circuit manufacturing, structural connection of printed circuit, printed circuit components, etc., to improve signal integrity, ensure that the gap between layers remains unchanged, and eliminate serious effects

Active Publication Date: 2016-10-12
P C B A ELECTRONICS WUXI
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] The purpose of the present invention is to solve the problems mentioned above in the background technology section through a high-speed rigid-flex board with unequal length of soft area and its manufacturing method

Method used

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  • High-speed hard-soft combining plate with soft areas of different lengths and manufacturing method thereof
  • High-speed hard-soft combining plate with soft areas of different lengths and manufacturing method thereof
  • High-speed hard-soft combining plate with soft areas of different lengths and manufacturing method thereof

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Embodiment Construction

[0039] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive. It should be noted that, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

[0040] In this embodiment, the high-speed rigid-flex board with unequal le...

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Abstract

The invention discloses a high-speed hard-soft combining plate with soft areas of different lengths and a manufacturing method thereof. Soft plates of different layers are designed into structures with bending areas, of which the lengths are gradient. When soft areas are bent, pulling and extruding may not occur to ensure same interlayer gaps and further eliminate severe influence on impedance due to change of a referential plane. Signal integrity of the hard-soft combining plate is improved.

Description

technical field [0001] The invention relates to the field of rigid-flex boards, in particular to a high-speed rigid-flex board with unequal soft regions and a manufacturing method thereof. Background technique [0002] Rigid-flex boards are lighter and more space-saving than ordinary circuit boards. Rigid-flex boards are an ideal solution for applications such as aerospace. The flexibility of this board is reflected in the fact that it can be folded, bent, and squeezed into very small spaces. It is suitable for any equipment and can improve the ability of product miniaturization. Rigid-flex boards can also reduce the manufacturing cost of the device, because of its small size, it can reduce the size of the package, thereby reducing the cost of materials required for production. Additionally, the flex circuit portion of the rigid-flex board reduces the need for interconnect wiring and soldered connectors. Make the whole system circuit more reliable and durable. Rigid-fle...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K3/36
CPCH05K1/028H05K1/147H05K3/361
Inventor 应朝晖陈懿姚景升郭鹏杜纯王敏
Owner P C B A ELECTRONICS WUXI
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