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CPCI module cooling method

A heat dissipation method and heat technology, applied in the computer field, can solve problems such as unsatisfactory heat conduction effect, and achieve the effects of easy promotion, small footprint, and reduced contact thermal resistance.

Active Publication Date: 2016-10-12
SHANDONG CHAOYUE DATA CONTROL ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the actual product, due to the influence of various factors such as part deformation, processing accuracy, and matching accuracy, the cold plate at both ends of the horizontally inserted CPCI module has locking strips, and the cold plate fits better with the chassis under the pressure of the locking strips. , and the cold plate in the middle of the module is not well attached to the chassis wall, and there are even large gaps, so the heat conduction effect is not ideal

Method used

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0022] In order to overcome the problem of excessive conduction thermal resistance caused by small contact area or loose fit when the upper reinforced CPCI module is bonded to the chassis. as attached image 3 , Figure 4 As shown, the present invention provides a kind of CPCI module cooling method, and this method is realized based on CPCI module 1, and described CPCI module 1 comprises mainboard 11, the heating element 12 that is installed on mainboard 11 and, is installed on mainboard 11 upper side and is used for The specific implementation process of the cold plate that transmits the heat of the heating element 12 is: the cold plate is designed as an elastic and stretchable structure to make it compressible, so that when the CPCI module 1 is in contact with the chassis 3, it can be closely attached to the cold plate. On chassis 3.

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Abstract

The invention discloses a CPCI module cooling method. The method is implemented on the basis of a CPCI module. The CPCI module comprises a master board, a heating element installed on the master board, and a cold plate installed on the master board and used for transmitting heat of the heating element. The method comprises the specific implementing steps that the cold plate is designed to be of an elastic stretchable structure so that the compressibility is achieved, so that when the CPCI module makes contact with a case, the CPCI module can be tightly attached to the case. Compared with the prior art, the CPCI module cooling method solves the problem of fitting of the cold plate and the case, and contact thermal resistance of the cold plate and the case is reduced; by means of the principle of phase change and heat conduction, the thermal resistance of the cold plate is decreased, so that the heat resistance of a heat path from the heating element of the module to the case is greatly lowered.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a method for heat dissipation of a CPCI module with strong practicability. Background technique [0002] The high openness, high reliability, and hot-swappability of CPCI make this technology not only widely used in communications, networks, and computers, but also suitable for real-time system control, real-time data acquisition, and military applications that require high-speed computing. [0003] The packaging structure of the CPCI board is based on the European board outline defined by IEC 60297-3, IEC 60297-4 and IEEE 1101.10. A total of 3U (100mm×160mm) and 6U (233.35mm×160mm) board sizes are defined. In the field of hardened computers, CPCI boards are often reinforced, that is, locked on the cold plate, and form a reinforced CPCI module with the cold plate and locking strips. [0004] The board card of the reinforced CPCI module and the cold plate are locked together w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 秦玉良孙永升陈乃阔
Owner SHANDONG CHAOYUE DATA CONTROL ELECTRONICS CO LTD
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