Magnetron sputtering planar target material shield cover

Abstract

The invention relates to a magnetron sputtering planar target shielding cover, comprising a target back plate, surrounding side baffles and a cover plate, the cover plate is fixed on the surrounding side baffles, and the surrounding side baffles are fixed on the target back plate , the distance between the upper positions of at least two opposite side guards among the surrounding side guards is greater than the distance between the bottom positions. It can reduce the deformation during the installation and the actual coating heating process, keep the distance between it and the target base stable, and reduce the frequency of sparking caused by the close distance between the cathode and anode.

Description

technical field [0001] The invention relates to the technical field of magnetron sputtering equipment, in particular to a modified magnetron sputtering plane target shielding cover, which is applied to magnetron sputtering thin film deposition. Background technique [0002] In the working process of vacuum magnetron sputtering, the electrons are affected by the electromagnetic field and approach the anode, and their trajectory is a cycloid. During the movement of the electrons to the anode, ionization collisions occur with Ar atoms, and the generated Ar ions are under the force of the electric field. Accelerated to fly to the cathode target under the action of high energy, and bombard the target with high energy, resulting in sputtering effect. In order to ensure the purity of the deposited film during the magnetron sputtering process, it is necessary to add a shield around the side of the planar target and the non-target area of ​​the target surface, where the radius of the...

AI Technical Summary

Problems solved by technology

[0003] In the application of large-scale planar targets, the traditional shielding cover is a split structure. The four separate baffles around the side of the target are directly fixed on the target back plate by screws, and the non-target areas around the edge of the target surface are fixed on the side. The cover plate mask on the baffle, in the use of large planar targets, the side baffles of this kind of separation structure are too long to be deformed due to heating during the production process, so that the distance between some side plates and the side of the cathode target is too close , more prone to fire or short circuit

[0004] In view of this phenomenon, the existing improved technical solution is that the magnetron sputtering planar target shielding cover includes a target back plate, surrounding side baffles, and fixing screws. The surrounding side baffles are an integral structure, and the surrounding side baffles It is fixed on the target back plate by screws, and the distance between the surrounding side baffle and the side of the internal cathode target should be 2cm after installation. Although this technology can guarantee the product quality, the production capacity is low and the efficiency is also low.

At the same time, it also brings waste of resources and higher production costs.

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