A device and method for drilling a hole using a laser beam

Abstract

The invention provides a device and method for punching through a laser beam. The device comprises a container (20), a laser output shaper (50) and a driving system (31). The laser output shaper (50) is located in the container (20) and rotationally connected with the container (20). The laser output shaper (50) comprises a laser device array and a convex lens array. The laser device array comprises an even number of laser devices which are arranged linearly and symmetrical about the rotating axis of the laser output shape (50). The convex lens array comprises convex lenses in one-to-one correspondence with the laser devices. The position of each convex lens is adjustable in the vertical direction. The laser output shaper (50) further comprises a controller used for controlling the beam strength of each laser device. The driving system (31) is used for driving the laser output shaper (50) to rotate. The device and method can achieve laser punching more easily and conveniently, and holes with small taper can be manufactured.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a device and method for drilling holes with laser beams. Background technique [0002] Laser drilling technology is a technology that uses a laser beam as a heat source and uses a heat removal method to separate materials. In the process of laser drilling, the high-power pulsed laser is focused on the surface of the workpiece, and the material is rapidly heated to the temperature of melting and vaporization. Then, under the joint action of the recoil pressure of the rapid expansion of the material gas and the pressure of the high-pressure auxiliary gas, the workpiece The liquid in the upper molten state is extruded out of the hole, and the above process is continued under the action of the subsequent pulse laser, and the material is continuously removed until a through hole is formed. [0003] When using laser drilling technology to process through holes, the taper is a...

AI Technical Summary

Problems solved by technology

However, since the two laser heads and the required drilling position must be kept on the same straight line through two high-precision motion platforms, the coaxiality of the upper and lower lasers and the accuracy of the motion platform There are extremely high requirements

[0010] To sum up, although the existing method improves the taper of the hole to a certain extent, it has disadvantages such as complicated device and difficult operation. Therefore, how to use a simpler and more convenient device and method to carry out laser drilling, and To improve the taper of the hole has become a technical problem to be solved urgently by those skilled in the art

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