A laser drilling device and method for improving hole taper

Abstract

The invention discloses a laser drilling device capable of improving hole taper. The laser drilling device comprises a laser generator and further comprises a reflection unit and a reflection regulating mechanism, wherein the laser generator is fixedly arranged on one side of a workpiece in a relative manner; the reflection unit and the reflection regulating mechanism are arranged on the other side of the workpiece; after the laser generator machines a through hole with a taper in the workpiece, the laser beams penetrate through the through hole, fall on the reflection plane of the reflection unit, and finally fall on the circumference and the inner wall of the through hole after being reflected on the reflection plane; the reflection regulating mechanism drives the reflection unit to move to enable the reflected laser beams to fall on different positions of the circumference and the inner wall of the through hole so as to gradually eliminate the taper in the through hole. Only the same laser generator is adopted to machine the target workpiece and improve dimensionality of the target workpiece so as to avoid the defects of complicated device, higher cost and difficulty in control caused by introduction of a magnetic field, a flow field and other energy fields, and simplify installation and application.

Description

technical field [0001] The invention relates to the field of laser processing, in particular to a laser drilling device and method for improving hole taper. Background technique [0002] Laser drilling technology is a technology that uses a laser beam as a heat source and uses a heat removal method to separate materials. In the process of laser drilling, the high-power pulsed laser is focused on the surface of the workpiece, and the material is rapidly heated to the temperature of melting and vaporization, and then under the joint action of the recoil pressure of the rapid accumulation and expansion of the material gas and the pressure of the high-pressure auxiliary gas, The liquid in the molten state on the workpiece is extruded out of the hole, and the above process is continued under the action of the subsequent pulse laser, and the material is continuously removed until a through hole is formed. [0003] Compared with other drilling technologies, laser drilling technolo...

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Problems solved by technology

[0009] To sum up, the hole processed by the existing laser processing method inevitably has a taper, and the existing method can improve the taper of the hole to a certain extent, but there are still disadvantages such as complex device and difficult operation, and there is an urgent need Invent a new method to improve the taper of the hole in laser processing

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