Heat conduction film and manufacturing method thereof

Abstract

The invention discloses a heat conduction film and a manufacturing method thereof. The heat conduction film successively comprises, from bottom to top, a bottom layer of a flexible base material, a structural layer and a surface layer of the flexible base material. The structural layer is formed by geometric blocks which are distributed on a bottom layer surface in a protruded mode. Connected grooves are formed between the adjacent geometric blocks. A thickness of the structural layer is 30-50 microns. A width of each groove is the 0.5-3 microns. A pressure working medium is filled in each groove and each groove is full of the pressure working medium. Groove ports around the heat conduction film are plugged. Pressure of the pressure working medium in each groove is 0.5-2MPa. The heat conduction film of the invention has a series of advantages that heat conductivity and an insulating property are possessed; a suitable field is wide, manufacturing cost is low and so on.

Description

technical field [0001] The invention belongs to the technical field of new conductive materials, and relates to a method for preparing a heat-conducting film. Background technique [0002] Regardless of whether it is a mechanism or an electrical device, excessively high operating temperatures will often result in poor function or even failure, and will also shorten the service life, so different heat dissipation devices or mechanisms are required to avoid operating temperatures above the critical value. [0003] With the development of electronic devices and products to the field of high integration and high computing, its calorific value increases accordingly. On the other hand, its volume is getting smaller and smaller, and its heat generation is more concentrated. Traditional heat sinks are generally made of aluminum or copper. At present, whether it is chip packaging or product system heat dissipation, these two materials are used to directly dissipate heat or cooperate ...

AI Technical Summary

Problems solved by technology

[0007] Thermally conductive film materials currently on the market include natural graphite thermally conductive film, artificial graphite thermally conductive film, nano-carbon thermally conductive film, high thermally conductive materials carbon nanotubes and graphene can also be made into thermally conductive film, but the price of raw materials is high and the technology is immature.

[0008] The various heat sinks and thermal conductive films mentioned above all have conductive properties, which will conduct electricity for some electronic components with conductive lines, which will easily cause short circuits, and the price is often several thousand yuan per square meter, ranging from a few One hundred yuan per square meter cannot benefit general mass products, and only a few products with high unit prices can afford this type of thermal conductive film

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