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Reactive silicone composition, hotmelt material made therefrom, and curable hotmelt composition

一种反应性有机硅、热熔材料的技术，应用在半导体/固态器件零部件、半导体器件、胶粘剂等方向，能够解决热熔性能不足等问题，达到优异瞬时和永久性粘附性能、优异架藏稳定性的效果

Active Publication Date: 2016-09-21
DOW SILICONES CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the hot-melt properties of these compositions are not sufficient for practical applications

Method used

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  • Reactive silicone composition, hotmelt material made therefrom, and curable hotmelt composition
  • Reactive silicone composition, hotmelt material made therefrom, and curable hotmelt composition
  • Reactive silicone composition, hotmelt material made therefrom, and curable hotmelt composition

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[0084] The reactive silicone composition, hot melt material, and curable hot melt composition of the present invention will be further described in more detail with reference to practical examples and comparative examples. In the formula, Me, Vi, and Ep correspond to methyl, vinyl, and 3-glycidyloxypropyl, respectively.

[0085] [Practical example 1]

[0086] A reactive silicone composition was prepared by mixing 32.5 parts by mass of an organopolysiloxane resin represented by the following average unit formula:

[0087] (ViMe 2 SiO 1 / 2 ) 0.11 (Me 3 SiO 1 / 2 ) 0.33 (SiO 4 / 2 ) 0.56 (HO 1 / 2 ) 0.02

[0088] 32.5 parts by mass of an organopolysiloxane resin represented by the following average unit formula:

[0089] (Me 3 SiO 1 / 2 ) 0.44 (SiO 4 / 2 ) 0.56 (HO 1 / 2 ) 0.02

[0090] 28.0 parts by mass of diorganopolysiloxane represented by the following average formula:

[0091] Me 3 SiO(Me 2 SiO) 789 (MeViSiO) 11 SiMe 3

[0092]5.0 parts by mass of organohydr...

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Abstract

The present invention relates to a reactive silicone composition for preparing a hotmelt material, which contains: (A) an organopolysiloxane resin expressed in a specific average unit formula; (B) an organopolysiloxane resin expressed in a specific average unit formula, which does not include alkenyl groups; (C) a diorganopolyxiloxane expressed in a specific average formula; (D) an organohydrogenpolysiloxane having two silicon-bonded hydrogen atoms in the molecule; (E) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in the molecule; and (F) a hydrosilyated catalyst. When the reactive silicone composition is reacted, it can prepare the hotmelt material which has excellent shelf-life stability and an immediate adhesive function by a hot melt process.

Description

technical field [0001] The present invention relates to reactive silicone compositions for forming hot melt materials, hot melt materials made therefrom, and curable hot melt compositions comprising the same. Background technique [0002] Curable silicone compositions are known to have excellent properties such as heat and cold resistance, electrical insulation, weather resistance, water repellency, transparency and the like. Due to these properties, these compositions find wide application in a variety of industries. Since these compositions are superior to other organic materials in their color change and deterioration of physical properties, it is expected that such compositions will be useful as materials for optical parts. For example, U.S. Patent Application Publication No. 2004 / 116640A1 discloses an optical silicone resin composition for a light emitting diode (LED), comprising: a silicone resin having at least two silicon-bonded alkenyl groups in the molecule; an o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04H01L33/50
CPCC08L83/04C08G77/12C08G77/16C08G77/20C08G77/70C09J183/04C08K3/22C08K5/56C08L83/00C08G77/08C08G77/38C08G2170/20C08K2201/00H01L23/296
Inventor 赵建山崎春菜陆周荣吉武诚
Owner DOW SILICONES CORP
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