Single-section type silicon rod cutoff machine and cutoff method thereof

Abstract

The invention discloses a single-section type silicon rod cutoff machine and a cutoff method of the single-section type silicon rod cutoff machine. The single-section type silicon rod cutoff machine comprises a machine base, a silicon rod conveying platform and single-section cutting equipment, wherein the silicon rod conveying platform is arranged in the cutting region of the machine base and used for bearing silicon rods to be cut and driving the silicon rods to be conveyed in the axial direction of the silicon rods; the single-section cutting equipment comprises a movable cutting frame slidably arranged on the machine base along the silicon rod conveying platform and a single-section linear cutting unit, wherein the single-section linear cutting unit is arranged on the movable cutting frame, arranged above the silicon rod conveying platform in a liftable manner and used for conducting single-section cutting in silicon rod cutting, and cut single-section silicon rod sections meeting the workpiece standard are obtained. According to the single-section type silicon rod cutoff machine and the cutoff method, the position of the movable cutting frame is adjusted according to the specified silicon rod size, and then single-section cutting is conducted in silicon rod cutting through the single-section linear cutting unit, so that the silicon rods to be cut accord with the specified cutting length, and the cut single-section silicon rod sections meeting the workpiece standard are obtained; and by adjusting the position of the movable cutting frame, the requirement of the cutting work of the silicon rods with any size can be met.

Description

technical field [0001] The invention relates to the technical field of silicon rod cutting, in particular to a single-stage silicon rod cutting machine and a cutting method thereof. Background technique [0002] Silicon rod cutting technology is a relatively advanced square extraction processing technology in the world at present. Its principle is to rub the workpiece (such as silicon rod, sapphire, or other semiconductor hard and brittle materials) through high-speed moving diamond wire, and cut out the square. Ingot, so as to achieve the purpose of cutting. During the cutting process of the workpiece, the diamond wire is guided by the guide wheel to form a wire net on the main wire roller, and the workpiece to be processed is fed by the rise and fall of the worktable. Under the action of the pressure pump, the assembly The cooling water automatic spraying device on the equipment sprays the cooling water to the cutting part of the diamond wire and the workpiece, and the re...

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Problems solved by technology

[0003] However, there are still deficiencies in the current silicon rod cutting machine. For example, the current silicon rod cutting machine cannot control the size of the silicon rod.

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