A high-temperature film strain gauge and its manufacturing method

Abstract

The invention discloses a high-temperature thin film strain gauge and its manufacturing method. The high-temperature thin film strain gauge comprises a SiO2 insulating film, a strainmeter sensitive grid film, a sensitive grid barrier film and a bonding pad barrier film. The area of a strainmeter sensitive grid is covered with the sensitive grid barrier film. The area outside the strainmeter sensitive grid is covered with the bonding pad barrier film. The strainmeter sensitive grid is a NiCr alloy strainmeter sensitive grid. The sensitive grid barrier film is a SiOxNy film. The bonding pad barrier film is an ITO film. By using the SiOxNy film as an antioxidant protection film of a thin film strain gauge, life of the thin film strain gauge is prolonged. By using the ITO film as a protective film of a bonding pad part, reliability and life of the thin film strain gauge in a high-temperature working environment are effectively improved. Structure and physical properties of the NiCr high-temperature thin film strain gauge are not changed within the range of 600 DEG C, and the NiCr high-temperature thin film strain gauge has good stress-strain test performance.

Description

technical field [0001] The invention relates to a thin-film strain gauge, in particular to a high-temperature thin-film strain gauge and a manufacturing method thereof. Background technique [0002] Due to the many unique properties of substances in the form of thin films, thin film devices have become widely used in the field of modern science and technology, especially modern instruments and various new sensors are constantly required to develop in the direction of miniaturization. Thin film technology will play an increasing role. Thin film resistance strain gauge is currently the most commonly used stress analysis sensitive element. It mainly uses the characteristic that the resistance of the film material will change in response to external stress, and converts the change of resistance value into the change of voltage value. [0003] Contact and non-contact methods can be used for stress and strain measurement. The non-contact method is mainly composed of optical measu...

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Problems solved by technology

[0003] Contact and non-contact methods can be used for stress and strain measurement. Non-contact methods are mainly composed of optical measurement methods. However, optical measurement of steam-filled pipelines will inevitably cause large errors

The main method of contact measurement is the strain gauge method. The traditional direct-adhesive foil strain gauge is generally used in the measurement of medium and low temperature fields. In the field of high temperature (>350°C), it will be difficult to Use; if the armored type is used, that is, the strain gauge is encapsulated inside the high temperature resistant alloy, the flexibility of the strain gauge will be greatly reduced

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