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Laminated wiring film for electronic components and sputtering target for coating layer formation

A technology for laminating wiring films and electronic components, which is applied in sputtering plating, ion implantation plating, coating, etc., can solve the problems of easy peeling and low adhesion, improve reliability, and facilitate stable manufacturing Effect

Active Publication Date: 2018-06-29
HITACHI METALS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, Ag has low adhesion to the substrate, is easy to peel off, and reacts easily with chlorine and sulfur, so there is a problem in weather resistance

Method used

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  • Laminated wiring film for electronic components and sputtering target for coating layer formation
  • Laminated wiring film for electronic components and sputtering target for coating layer formation
  • Laminated wiring film for electronic components and sputtering target for coating layer formation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] First, the sputtering targets for coating layer formation of sample No. 1-12 and sample No. 14 shown in Table 1 were prepared. Using the vacuum melting method, the raw materials are weighed so as to form each composition, and an ingot is produced by melting and casting in a vacuum melting furnace. The ingot was machined without plastic working, and a sputtering target with a diameter of 100 mm and a thickness of 5 mm was produced. Moreover, the sputtering target material of Ni-16 atomic % Mn was also produced by the same method.

[0077] In addition, Mo powder with a purity of 99.99%, an average particle size of 6 μm, and a powder of Ni with an average particle size of 70 μm were weighed, mixed with a cross rotary mixer to obtain a mixed powder, and then filled into a soft container with an inner diameter of 133 mm, an outer diameter of 139 mm, and a height of 30 mm. in a steel container. Then, the mild steel container was heated at 450° C. for 10 hours, degassed, sea...

Embodiment 2

[0093] Using each sputtering target produced in Example 1, a laminated wiring film in which an underlayer with a film thickness of 50 nm, a conductive layer made of Ag with a film thickness of 200 nm, and a top layer with a film thickness of 50 nm was sequentially formed on a glass substrate was produced. sample. Furthermore, the adhesiveness of each sample and the moisture resistance which is one of weather resistance were evaluated. It should be noted that the above-mentioned base layer and top layer are layers composed of the covering layer materials in Table 2.

[0094] Adhesive evaluation was performed by the method similar to Example 1. Then, the case where one piece was not peeled off was evaluated as ◯, the case where 1 to 10 pieces were peeled was evaluated as Δ, and the case where 11 or more pieces were peeled was evaluated as x.

[0095] In addition, in the evaluation of moisture resistance, the prepared laminated wiring film was left to stand in an atmosphere at ...

Embodiment 3

[0103] Oxidation resistance was evaluated using samples of the laminated wiring film produced in Example 2. Each sample was heat-processed at the temperature of 200 degreeC - 300 degreeC for 30 minutes in air atmosphere, and it measured reflectance similarly to Example 2. Table 3 shows the evaluation results.

[0104] [table 3]

[0105]

[0106] On a film substrate, oxidation resistance up to 250°C is required. As shown in Table 3, it was confirmed that, in sample No.1 to sample No.3 and No.14 which are comparative examples, the reflectance starts to decrease at 250° C. or higher.

[0107] On the other hand, it turns out that the laminated wiring film for electronic components of this invention maintains the high reflectance of 50% or more up to 250 degreeC, and has high oxidation resistance. Furthermore, at a high temperature of 300°C, for samples No. 6 and No. 10 in which the total amount of Mn and Cu exceeds 30%, the reflectance decreases. Therefore, in order to obtai...

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Abstract

The present invention provides a laminated wiring layer for an electronic component having a new coating layer and a sputtering target material for forming a coating layer, capable of stably performing wet etching with high accuracy while ensuring adhesion, weatherability, and oxidation resistance. The laminated wiring film for an electronic component includes a conductive layer containing Ag or an Ag alloy and a coating layer covering at least one surface of the conductive layer, the coating layer containing 1 to 25 atomic% of Mn, 4 to 40 atomic% of Mo, a total of 60 atomic% or less of the Mn and the Mo and at least one element selected from the group consisting of Cu and Fe, and the balance being Ni and unavoidable impurities. The coating layer may be formed of a sputtering target as follows: 1 to 25 atomic% of Mn, 4 to 40 atomic% of Mo, and a total of 60 atomic% or less of the Mn, the Mo and one or more elements selected from Cu or Fe, the balance being Ni and unavoidable impurities, with Curie point below normal temperature.

Description

technical field [0001] The present invention relates to a laminated wiring film for electronic components that can be used for, for example, a touch panel; and a sputtering target for forming a coating layer covering a conductive layer of the laminated wiring film for electronic components. Background technique [0002] In recent years, flat display devices (flat panel displays, Flat Panel Display (hereinafter referred to as "FPD") is a commercialization of new portable terminals such as smartphones and tablet PCs that combine a touch panel that provides direct operability while viewing the screen. Indium-tin oxide (Indium TinOxide: hereinafter referred to as "ITO") which is a transparent conductive film is generally used as a sensor film of a position detection electrode of these touch panels. In addition, in the bridge wiring and the lead wiring, as a metal wiring film having a lower resistance value (hereinafter referred to as low resistance), for example, a laminated wi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/34C22C19/03
CPCC22C19/002C22C19/005C22C19/03C23C14/3407
Inventor 村田英夫
Owner HITACHI METALS LTD
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