Server cluster cpu heat radiating system

A server cluster and heat dissipation system technology, applied in the field of server cluster cpu heat dissipation system, to achieve the effect of improving heat dissipation efficiency, low energy consumption, safe and reliable energy consumption

Inactive Publication Date: 2016-08-24
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention provides a server cluster cpu heat dissipation system aiming at the current needs and the shortcomings of the development of the prior art

Method used

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  • Server cluster cpu heat radiating system
  • Server cluster cpu heat radiating system
  • Server cluster cpu heat radiating system

Examples

Experimental program
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Embodiment

[0019] The CPU heat dissipation system of a server cluster described in this embodiment has an overall structure as attached figure 1 As shown, it includes a server cluster and refrigeration equipment and compressors arranged outside the server cluster. The server cluster includes several servers, and each server is equipped with several CPUs; the refrigeration equipment is connected to the compressor, and the The compressor is connected to the server cluster; the external air becomes cold air through the refrigeration equipment, and then the cold air is compressed and stored by the compressor, and finally the compressed cold air passes through the server to cool each CPU radiator.

[0020] In the server cluster CPU heat dissipation system of this embodiment, the refrigeration equipment adopts a cold air generator, and a cold air pipeline is arranged between the compressor and each server, and the compressed cold air generated by the compressor is delivered to the server through t...

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PUM

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Abstract

The invention discloses a server cluster cpu heat radiating system, and relates to a server heat radiating technique. The server cluster cpu heat radiating system comprises a server cluster and refrigerating equipment and a compressor which are arranged outside the server cluster; the server cluster comprises a plurality of servers, and a plurality of cpus are arranged in each server; the refrigerating equipment is connected with the compressor, and the compressor is connected with the server cluster; outside air is turned into cool air through the refrigerating equipment, the stored cool air is compressed by the compressor, and finally the compressed cool air conducts heat radiating and cooling through radiators of all the cpus. According to the Server cluster cpu heat radiating system, the cpus are cooled in a targeted mode by concentratedly supplying the cool air, the heat radiating efficiency of the cpus is greatly improved, usage of fans is reduced or omitted, and the advantages of being capable of lowering noise, safe, reliable, low in energy consumption and the like are achieved.

Description

technical field [0001] The invention relates to server heat dissipation technology, in particular to a server cluster CPU heat dissipation system. Background technique [0002] The CPU is the core component of the server system. Good heat dissipation can improve the stability and reliability of the server. When the temperature of the CPU approaches or exceeds the upper limit, the server will crash and stop working. At present, the mainstream radiator is the radiator released by Intel, which is installed on the motherboard and cooperates with the fan to dissipate heat, and the fan blows away the heat. However, this CPU heat dissipation method has disadvantages such as high noise and power consumption; in addition, heat will continue to accumulate in the server, causing the temperature in the server to continue to rise, affecting the safety of other electronic devices. Contents of the invention [0003] The present invention provides a server cluster cpu heat dissipation sy...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20Y02D10/00
Inventor 范鹏飞
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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