Chip on film and display device

Abstract

The present invention provides a chip on film. The chip on film comprises a flexible circuit board, and the flexible circuit board includes a conductive layer consisting of a first binding zone located at the first end of the conductive layer and a second binding zone located at the second end of the conductive layer; the first binding zone is configured to bind a display substrate, and the second binding zone is configured to bind a printing circuit board, wherein the first binding zone and the second binding zone are respectively located at two opposite surfaces of the conductive layer. Correspondingly, the present invention further provides a display device. The chip on film and the display device are able to reduce the whole thickness of the display device and prevent the chip on the chip on film from being extruded.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a chip-on-chip film and a display device. Background technique [0002] The chip-on-chip technology (ChipOnFlex, or, ChipOnFilm, COF) is a technology of bonding the pads on the driver chip and the pins on the flexible circuit board by thermal compression. figure 1 It is a structural diagram of a chip-on-chip film in the prior art. The flexible circuit board 20 includes a base 21, a metal layer 22 and a paint film 23. The paint film 23 exposes both ends of the metal layer 22, and the exposed two parts are connected to the display substrate 30 and the display substrate 30 respectively. printed circuit board 40 binding, such as figure 2 As shown; for a bottom-emission organic light-emitting display device, after the flexible circuit board 20 is bound to the display substrate 30 and the printed circuit board 40 respectively, the flexible circuit board 20 is bent toward the side of...

AI Technical Summary

Problems solved by technology

figure 1 It is a structural diagram of a chip-on-chip film in the prior art. The flexible circuit board 20 includes a base 21, a metal layer 22 and a paint film 23. The paint film 23 exposes both ends of the metal layer 22, and the exposed two parts are connected to the display substrate 30 and the display substrate 30 respectively. printed circuit board 40 binding, such as figure 2 As shown; for a bottom-emission organic light-emitting display device, after the flexible circuit board 20 is bound to the display substrate 30 and the printed circuit board 40 respectively, the flexible circuit board 20 is bent toward the side of the display substrate 30 away from the light-emitting direction After, such as image 3 As shown, it is easy to cause the following problems: the driver chip 10 on the flexible circuit board 20 is exposed outside, which is easy to be squeezed, and causes the frame width of the display device to increase; the components 41 on the printed circuit board 40 and the printed circuit board 40 The binding areas are located on different sides, and when the printed circuit board 40 is bound to the flexible circuit board 20, it is easy to cause crush damage to the component 41; in addition, after the flexible circuit board 20 is bent, the printed circuit board 40 is located above the flexible circuit board 20, Therefore, when the bending degree of the flexible circuit board 20 is constant, the overall thickness of the display device is relatively large.

Images