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Epoxy resin composition and preparation method thereof

A technology of epoxy resin and resin mixture, which is applied in the field of organic synthetic polymer materials, can solve the problems of low-cost preparation of high-temperature-resistant epoxy composite materials, and achieve short preparation cycle, low preparation cost and low room temperature viscosity Effect

Active Publication Date: 2018-07-03
NAT UNIV OF DEFENSE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the epoxy resins in the current prior art are difficult to meet the two performance requirements of high temperature resistance and low viscosity at the same time, so it is difficult to realize the low-cost preparation of high temperature resistant epoxy composite materials

Method used

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  • Epoxy resin composition and preparation method thereof
  • Epoxy resin composition and preparation method thereof
  • Epoxy resin composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] An epoxy resin composition, its components (mass parts) are 100 parts of 4,4'-diaminodiphenylmethylene glycidyl amine (epoxy 1), 20 parts of five-membered diaza rings Epoxy resin (epoxy 2), 150 parts methyltetrahydrophthalic anhydride (anhydride 1), 1.5 parts 2,4,6-tris-(dimethylaminomethyl)phenol (accelerator 1).

[0027] Among them, the molecular formula of 4,4'-diaminodiphenylmethylene glycidylamine is:

[0028]

[0029] The molecular structural formula of the five-membered diazocyclic epoxy resin is:

[0030]

[0031] The molecular structural formula of methyltetrahydrophthalic anhydride is:

[0032]

[0033] The molecular structural formula of 2,4,6-tri-(dimethylaminomethyl)phenol is:

[0034]

[0035] The preparation method of above-mentioned epoxy resin composition, comprises the following steps:

[0036] S1. Add 100 parts by mass of 4,4'-diaminodiphenylmethylene glycidylamine and 20 parts by mass of five-membered diazacyclic epoxy resin into the r...

Embodiment 2

[0041] An epoxy resin composition, its components (mass parts) are 110 parts of 4,4'-diaminodiphenylmethylene glycidyl amine (epoxy 1), 10 parts of five-membered diaza rings Epoxy resin (epoxy 2), 140 parts methyltetrahydrophthalic anhydride (anhydride 1), 2 parts 2,4,6-tris-(dimethylaminomethyl)phenol (accelerator 1).

[0042] The preparation method of above-mentioned epoxy resin composition, comprises the following steps:

[0043] S1. Add 110 parts by mass of 4,4'-diaminodiphenylmethylene glycidylamine and 10 parts by mass of five-membered diazacyclic epoxy resin into the reactor and mix them, and heat up to 48°C , stir 2h with 1250rpm stirring speed, then naturally cool to room temperature, obtain the mixture of two kinds of epoxy resins;

[0044] S2, adding 2,4,6-tri-(dimethylaminomethyl)phenol in 2 parts by mass to the mixture of two epoxy resins, stirring at 1250 rpm for 2 hours at room temperature, and standing for 28 hours, obtain a resin mixture;

[0045] S3. Mix t...

Embodiment 3

[0048] An epoxy resin composition, its components (mass parts) are 90 parts of 4,4'-diaminodiphenylmethylene glycidyl amine (epoxy 1), 30 parts of five-membered diaza rings Epoxy resin (epoxy 2), 160 parts methyltetrahydrophthalic anhydride (anhydride 1), 2 parts 2,4,6-tris-(dimethylaminomethyl)phenol (accelerator 1).

[0049] A preparation method of the low-viscosity and high-temperature-resistant epoxy resin system of this embodiment, the steps are the same as in Embodiment 1.

[0050] In this example, the glass transition temperature of the obtained epoxy resin composition is 200°C, the initial viscosity at room temperature is 800mPa·s, and the low viscosity plateau time at 45°C can reach 186min, the above parameters are obviously better than those in the prior art epoxy resin composition.

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Abstract

The invention discloses an epoxy resin composition and a preparation method thereof. The epoxy resin composition comprises the following components in parts by mass: 90-110 parts of 4, 4'-diamine diphenyl methylene glycidyl amine, 10-30 parts of quinary diazacyclo epoxy resin, 140-160 parts of methyl tetrahydrobenzene and 1-3 parts of 2,4,6-tri(dimethylaminomethyl) phenol. The epoxy resin composition has the advantages of being excellent in high temperature resistance, low in room-temperature viscosity, suitable for preparing a high-performance composite material by a liquid mould shaping process, simple in component, easy to synthesize or purchase, low in preparation cost and the like. The preparation method for the epoxy resin composition can be used for preparing the epoxy resin composition, and has the advantages of being simple to operate, easy to control, short in preparation period, low in cost and the like.

Description

technical field [0001] The invention relates to the technical field of organic synthetic polymer materials, in particular to an epoxy resin composition and a preparation method thereof. Background technique [0002] Advanced composite materials have the characteristics of light weight and high strength, and are widely used in aerospace, weaponry, energy and other fields. Epoxy resin is a high-performance matrix material commonly used in advanced composite materials. The development of advanced composite materials puts forward new requirements for epoxy resin matrix with high temperature resistance and low molding cost. [0003] Liquid Composite Molding (LCM) is an advanced low-cost preparation technology for composite materials. Its principle is to inject liquid polymer into a closed mold cavity with fiber preforms, or heat and melt it into The resin film in the mold cavity, the liquid polymer completes the infiltration of the fiber while flowing and filling the mold, and i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/38C08L63/00C08G59/42
CPCC08G59/38C08G59/42C08L63/00C08L2201/08
Inventor 邢素丽吴晴晴刘钧肖加余杨金水
Owner NAT UNIV OF DEFENSE TECH
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